Intel E3300 AT80571RG0601ML Data Sheet

76

Datasheet

The case temperature is defined at the geometric top center of the processor. Analysis 

indicates that real applications are unlikely to cause the processor to consume 

maximum power dissipation for sustained time periods. Intel recommends that 

complete thermal solution designs target the Thermal Design Power (TDP) indicated in 

 instead of the maximum processor power consumption. The Thermal Monitor 

feature is designed to protect the processor in the unlikely event that an application 

exceeds the TDP recommendation for a sustained periods of time. For more details on 

the usage of this feature, refer to 

NOTES:
1.

Specification is at 36 °C T

C

 and minimum voltage loadline. Specification is ensured by 

design characterization and not 100% tested.

2.

Specification is at 34 °C T

C

 and minimum voltage loadline. Specification is ensured by 

design characterization and not 100% tested.

3.

Thermal Design Power (TDP) should be used for processor thermal solution design targets. 
The TDP is not the maximum power that the processor can dissipate.

4.

This table shows the maximum TDP for a given frequency range. Individual processors 
may have a lower TDP. Therefore, the maximum T

C

 will vary depending on the TDP of the 

individual processor. Refer to thermal profile figure and associated table for the allowed 
combinations of power and T

C

. 

5.

775_VR_CONFIG_06 guidelines provide a design target for meeting future thermal 
requirements.

E3300
E3200

2.50
2.40

65.0
65.0

8
8

6
6

775_VR_CONFIG

_06

(65 W)

5
5

See 

and