Intel SC5650BCDP User Manual

Page of 71
Intel
®
 Server System SC5650BCDP TPS 
Environmental and Regulatory Specifications 
 
Revision 1.5 
Intel order number: E80367-002 
39
 
8.  Environmental and Regulatory Specifications 
8.1  System Level Environmental Limits 
The following table defines the system level operating and non-operating environmental limits.  
Table 32. System Environmental Limits Summary 
Parameter 
Limits 
Operating Temperature 
+10
° C to +35° C with the maximum rate of change not to exceed 10° C per hour 
Non-Operating 
Temperature 
-40
° C to +70° C 
Non-Operating Humidity 
90%, non-condensing at 35
° C 
Acoustic noise  
Sound power: 7.0 BA in an idle state at typical office ambient temperature. (23 
+/- 2 degrees C) 
Shock, operating 
Half sine, 2 g peak, 11 mSec 
Shock, unpackaged 
Trapezoidal, 25 g, velocity change 136 inches/sec (≧40 lbs to > 80 lbs) 
Shock, packaged 
Non-palletized free fall in height of 24 inches (≧40 lbs to > 80 lbs) 
Vibration, unpackaged 
5 Hz to 500 Hz, 2.20 g RMS random 
Shock, operating 
Half sine, 2 g peak, 11 mSec 
ESD* 
+/-15 KV except I/O port +/-8 KV per the Intel Environmental test specification 
System Cooling 
Requirement in BTU/Hr 
2550 BTU/hour 
IMPORTANT NOTES: 
The host system with the Intel
®
 Server Board S5500BC requires the use of shielded 
LAN cable to comply with Immunity regulatory requirements. Use of non-shielded cables may result in the product 
having insufficient immunity electromagnetic effects, which may cause improper operation of the product.
 
8.2  Serviceability and Availability 
The system is designed to be serviced by qualified technical personnel only. 
The recommended Mean Time To Repair (MTTR) of the system is 30 minutes including 
diagnosis of the system problem. To meet this goal, the system enclosure and hardware were 
designed to minimize the MTTR.  
Following are the maximum times that a trained field service technician should take to perform 
the listed system maintenance procedures, after diagnosing the system and identifying the 
failed component.