Intel P6200 CP80617004122AW Data Sheet
Product codes
CP80617004122AW
Datasheet
5
Figures
Static and Transient Tolerance for Processors......................................................... 21
Overshoot Example Waveform ............................................................................. 22
Differential Clock Crosspoint Specification ................................................................... 30
Differential Clock Crosspoint Specification ................................................................... 31
10 Processor Package Drawing Sheet 3 of 3 ..................................................................... 36
11 Processor Top-Side Markings Example ........................................................................ 38
12 Processor Land Coordinates and Quadrants, Top View ................................................... 39
13 land-out Diagram (Top View – Left Side) ..................................................................... 42
14 land-out Diagram (Top View – Right Side) ................................................................... 43
15 Thermal Profile (Intel
11 Processor Top-Side Markings Example ........................................................................ 38
12 Processor Land Coordinates and Quadrants, Top View ................................................... 39
13 land-out Diagram (Top View – Left Side) ..................................................................... 42
14 land-out Diagram (Top View – Right Side) ................................................................... 43
15 Thermal Profile (Intel
Pentium
®
Dual-Core Processors with CPUID = 06F2h).................. 75
Pentium
®
Dual-Core Processors with CPUID = 06FDh) ................. 76
17 Case Temperature (TC) Measurement Location ............................................................ 77
18 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 79
19 Processor PECI Topology ........................................................................................... 83
20 Conceptual Fan Control on PECI-Based Platforms ......................................................... 84
21 Conceptual Fan Control on Thermal Diode-Based Platforms............................................ 84
22 Processor Low Power State Machine ........................................................................... 88
23 Mechanical Representation of the Boxed Processor ....................................................... 93
24 Space Requirements for the Boxed Processor (Side View).............................................. 94
25 Space Requirements for the Boxed Processor (Top View)............................................... 95
26 Space Requirements for the Boxed Processor (Overall View) .......................................... 95
27 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 97
28 Baseboard Power Header Placement Relative to Processor Socket ................................... 98
29 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................... 99
30 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)................... 99
31 Boxed Processor Fan Heatsink Set Points................................................................... 100
18 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 79
19 Processor PECI Topology ........................................................................................... 83
20 Conceptual Fan Control on PECI-Based Platforms ......................................................... 84
21 Conceptual Fan Control on Thermal Diode-Based Platforms............................................ 84
22 Processor Low Power State Machine ........................................................................... 88
23 Mechanical Representation of the Boxed Processor ....................................................... 93
24 Space Requirements for the Boxed Processor (Side View).............................................. 94
25 Space Requirements for the Boxed Processor (Top View)............................................... 95
26 Space Requirements for the Boxed Processor (Overall View) .......................................... 95
27 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 97
28 Baseboard Power Header Placement Relative to Processor Socket ................................... 98
29 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................... 99
30 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)................... 99
31 Boxed Processor Fan Heatsink Set Points................................................................... 100