Intel X5677 AT80614005145AB User Manual

67

The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA) package that 
interfaces with the baseboard via an LGA1366 socket. The package consists of a 
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is 
attached to the package substrate and core and serves as the mating surface for 
processor component thermal solutions, such as a heatsink. 

 shows a sketch 

of the processor package components and how they are assembled together. Refer to 
the Intel

 Processor 5500/5600 Series Thermal/Mechanical Design Guide for 

complete details on the LGA1366 socket.

The package components shown in 

1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors

1.

Socket and baseboard are included for reference and are not part of processor package.

The package mechanical drawings are shown in 

. The 

drawings include dimensions necessary to design a thermal solution and reflect the 
processor as received by Intel. These dimensions include:

1. Package reference with tolerances (total height, length, width, and so forth)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums

IHS

Substrate 

LGA1366 Socket

System Board 

Capacitors 

TIM

IHS

Substrate 

LGA 

System Board 

Capacitors 

Die

TIM