Intel L5238 AT80573JJ0676MT Data Sheet
Product codes
AT80573JJ0676MT
Thermal Specifications
84
2.
Implementation of the Dual-Core Intel® Xeon® Processor L5215 Thermal Profile should result in virtually
no TCC activation. Furthermore, utilization of thermal solutions that do not meet the processor Thermal
Profile will result in increased probability of TCC activation and may incur measurable performance loss.
(See
for details on TCC activation).
3.
The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not
require NEBS Level 3 compliance.
4.
The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating
temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances
per year, as compliant with NEBS Level 3.
5.
Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the
Short-Term Thermal Profile for a duration longer than the limits specified in Note 4 above, do not meet the
processor thermal specifications and may result in permanent damage to the processor.
6.
Refer to the Dual-Core Intel® Xeon® Processor 5200 Series in Embedded Thermal/Mechanical Design
Guidelines (TMDG) for system and environmental implementation details.
6.1.2
Thermal Metrology
The minimum and maximum case temperatures (T
CASE
) are specified in
are measured at the geometric top
center of the processor integrated heat spreader (IHS).
illustrates the
location where T
CASE
temperature measurements should be made. For detailed
guidelines on temperature measurement methodology, refer to the Dual-Core Intel®
Xeon® Processor 5200 Series Thermal/Mechanical Design Guidelines (TMDG).
Xeon® Processor 5200 Series Thermal/Mechanical Design Guidelines (TMDG).
Table 6-11. Dual-Core Intel® Xeon® Processor L5215 Thermal Profile Table
Power (W)
Nominal T
CASE_MAX
(°C)
Short-term T
CASE_MAX
(°C)
0
45
60
2
48
63
4
51
66
6
54
69
8
57
72
10
60
75
12
63
78
14
66
81
16
69
84
18
72
87
20
75
90