Intel L5310 HH80563JH0258M Data Sheet
Product codes
HH80563JH0258M
Debug Tools Specifications
126
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
9.3.1
Mechanical Considerations
The LAI is installed between the processor socket and the processor. The LAI plugs into
the socket, while the processor plugs into a socket on the LAI. Cabling that is part of
the LAI egresses the system to allow an electrical connection between the processor
and a logic analyzer. The maximum volume occupied by the LAI, known as the keepout
volume, as well as the cable egress restrictions, should be obtained from the logic
analyzer vendor. System designers must make sure that the keepout volume remains
unobstructed inside the system. In some cases, it is known that some of the electrolytic
capacitors fall inside of the keepout volume for the LAI. In this case, it is necessary to
move these capacitors to the backside of the board before using the LAI. Additionally,
note that it is possible that the keepout volume reserved for the LAI may include
different requirements from the space normally occupied by the heatsink. If this is the
case, the logic analyzer vendor will provide either a cooling solution as part of the LAI
or additional hardware to mount the existing cooling solution.
the socket, while the processor plugs into a socket on the LAI. Cabling that is part of
the LAI egresses the system to allow an electrical connection between the processor
and a logic analyzer. The maximum volume occupied by the LAI, known as the keepout
volume, as well as the cable egress restrictions, should be obtained from the logic
analyzer vendor. System designers must make sure that the keepout volume remains
unobstructed inside the system. In some cases, it is known that some of the electrolytic
capacitors fall inside of the keepout volume for the LAI. In this case, it is necessary to
move these capacitors to the backside of the board before using the LAI. Additionally,
note that it is possible that the keepout volume reserved for the LAI may include
different requirements from the space normally occupied by the heatsink. If this is the
case, the logic analyzer vendor will provide either a cooling solution as part of the LAI
or additional hardware to mount the existing cooling solution.
9.3.2
Electrical Considerations
The LAI will also affect the electrical performance of the FSB, therefore it is critical to
obtain electrical load models from each of the logic analyzer vendors to be able to run
system level simulations to prove that their tool will work in the system. Contact the
logic analyzer vendor for electrical specifications and load models for the LAI solution
they provide.
obtain electrical load models from each of the logic analyzer vendors to be able to run
system level simulations to prove that their tool will work in the system. Contact the
logic analyzer vendor for electrical specifications and load models for the LAI solution
they provide.
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