Intel Xeon 7130N LF80550KF0878M Data Sheet
Product codes
LF80550KF0878M
Dual-Core Intel
®
Xeon
®
Processor 7000 Series Datasheet
107
9
Debug Tools Specifications
Please refer to the ITP700 Debug Port Design Guide, eXtended Debug Port: Debug Port Design
Guide for Twin Castle Chipset Platforms, eXtended Debug Port: Debug Port Design Guide for MP
Platforms, and the appropriate platform design guide for more detailed information regarding
debug tools specifications.
Guide for Twin Castle Chipset Platforms, eXtended Debug Port: Debug Port Design Guide for MP
Platforms, and the appropriate platform design guide for more detailed information regarding
debug tools specifications.
9.1
Logic Analyzer Interface (LAI)
Intel is working with two logic analyzer vendors to provide logic analyzer interfaces (LAIs) for use
in debugging Dual-Core Intel Xeon processor 7000 series systems. Tektronix and Agilent should
be contacted to get specific information about their logic analyzer interfaces. The following
information is general in nature. Specific information must be obtained from the logic analyzer
vendor.
in debugging Dual-Core Intel Xeon processor 7000 series systems. Tektronix and Agilent should
be contacted to get specific information about their logic analyzer interfaces. The following
information is general in nature. Specific information must be obtained from the logic analyzer
vendor.
Due to the complexity of Dual-Core Intel Xeon processor 7000 series-based multiprocessor
systems, the LAI is critical in providing the ability to probe and capture FSB signals. There are two
sets of considerations to keep in mind when designing a Dual-Core Intel Xeon processor 7000
series-based system that can make use of an LAI: mechanical and electrical.
systems, the LAI is critical in providing the ability to probe and capture FSB signals. There are two
sets of considerations to keep in mind when designing a Dual-Core Intel Xeon processor 7000
series-based system that can make use of an LAI: mechanical and electrical.
9.1.1
Mechanical Considerations
The LAI is installed between the processor socket and the processor. The LAI pins plug into the
socket, while the processor pins plug into a socket on the LAI. Cabling that is part of the LAI
egresses the system to allow an electrical connection between the processor and a logic analyzer.
The maximum volume occupied by the LAI, known as the keepout volume, as well as the cable
egress restrictions, should be obtained from the logic analyzer vendor. System designers must
make sure that the keepout volume remains unobstructed inside the system. Note that it is possible
that the keepout volume reserved for the LAI may differ from the space normally occupied by the
Dual-Core Intel Xeon processor 7000 series heatsink. If this is the case, the logic analyzer vendor
will provide a cooling solution as part of the LAI.
socket, while the processor pins plug into a socket on the LAI. Cabling that is part of the LAI
egresses the system to allow an electrical connection between the processor and a logic analyzer.
The maximum volume occupied by the LAI, known as the keepout volume, as well as the cable
egress restrictions, should be obtained from the logic analyzer vendor. System designers must
make sure that the keepout volume remains unobstructed inside the system. Note that it is possible
that the keepout volume reserved for the LAI may differ from the space normally occupied by the
Dual-Core Intel Xeon processor 7000 series heatsink. If this is the case, the logic analyzer vendor
will provide a cooling solution as part of the LAI.
9.1.2
Electrical Considerations
The LAI will also affect the electrical performance of the FSB; therefore, it is critical to obtain
electrical load models from each of the logic analyzer vendors to be able to run system level
simulations to prove that their tool will work in the system. Contact the logic analyzer vendor for
electrical specifications and load models for the LAI solution they provide.
electrical load models from each of the logic analyzer vendors to be able to run system level
simulations to prove that their tool will work in the system. Contact the logic analyzer vendor for
electrical specifications and load models for the LAI solution they provide.
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