Intel Xeon 7130N LF80550KF0878M Data Sheet
Product codes
LF80550KF0878M
Mechanical Specifications
36
Dual-Core Intel
®
Xeon
®
Processor 7000 Series Datasheet
3.2
Processor Component Keepout Zones
The processor may contain components on the substrate that define component keepout zone
requirements. A thermal and mechanical solution design must not intrude into the required keepout
zones. Decoupling capacitors are typically mounted to either the topside or pin-side of the package
substrate. See
requirements. A thermal and mechanical solution design must not intrude into the required keepout
zones. Decoupling capacitors are typically mounted to either the topside or pin-side of the package
substrate. See
and
for keepout zones.
3.3
Package Loading Specifications
provides dynamic and static load specifications for the processor package. These
mechanical load limits should not be exceeded during heatsink assembly, shipping conditions, or
standard use condition. Also, any mechanical system or component testing should not exceed the
maximum limits. The processor package substrate should not be used as a mechanical reference or
load-bearing surface for thermal and mechanical solutions. The minimum loading specification
must be maintained by any thermal and mechanical solution.
standard use condition. Also, any mechanical system or component testing should not exceed the
maximum limits. The processor package substrate should not be used as a mechanical reference or
load-bearing surface for thermal and mechanical solutions. The minimum loading specification
must be maintained by any thermal and mechanical solution.
Table 3-1. Processor Loading Specifications
Parameter
Minimum
Maximum
Unit
Notes
Static Compressive
Load
Load
44
10
10
222
50
N
lbf
1,
2,
3,
4
NOTES:
1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.
2. This is the minimum and maximum static force that can be applied by the heatsink and retention solution to
1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.
2. This is the minimum and maximum static force that can be applied by the heatsink and retention solution to
maintain the heatsink and processor interface.
3. These parameters are based on limited testing for design characterization. Loading limits are for the package
only and do not include the limits of the processor socket.
4. This specification applies for thermal retention solutions that allow baseboard deflection.
44
10
10
288
65
N
lbf
5
5. This specification applies either for thermal retention solutions that prevent baseboard deflection or for the Intel
enabled reference solution (CEK).
Dynamic
Compressive Load
Compressive Load
222 N + 0.45 kg * 100 G
50 lbf (static) + 1 lbm * 100 G
N
lbf
6,
7
6. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement.
7. Experimentally validated test condition used a heatsink mass of 1 lbm (~0.45 kg) with 100 G acceleration
7. Experimentally validated test condition used a heatsink mass of 1 lbm (~0.45 kg) with 100 G acceleration
measured at heatsink mass. The dynamic portion of this specification in the product application can have
flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this validated
dynamic load (1 lbm x 100 G = 100 lb).
flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this validated
dynamic load (1 lbm x 100 G = 100 lb).
288 N + 0.45 kg * 100 G
65 lbf (static) + 1 lbm * 100 G
N
lbf
Transient
445
100
100
N
lbf
8
8. Transient loading is defined as a 2 second duration peak load superimposed on the static load requirement,
representative of loads experienced by the package during heatsink installation.