Intel Xeon 7130N LF80550KF0878M Data Sheet

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The Dual-Core Intel Xeon processor 7000 series requires a thermal solution to maintain 
temperatures within operating limits. Any attempt to operate the processor outside these operating 
limits may result in permanent damage to the processor and potentially other components within 
the system. As processor technology changes, thermal management becomes increasingly crucial 
when building computer systems. Maintaining the proper thermal environment is key to reliable, 
long-term system operation.

A complete solution includes both component and system level thermal management features. 
Component level thermal solutions can include active or passive heatsinks attached to the 
processor IHS. Typical system level thermal solutions may consist of system fans combined with 
ducting and venting.

For more information on designing a component level thermal solution, refer to the Dual-Core 
Intel

 Processor 7000 Sequence Thermal/Mechanical Design Guidelines. 

The boxed processor will ship with a component thermal solution. Refer to 

 for details on 

the boxed processor.

To allow the optimal operation and long-term reliability of Intel processor-based systems, the 
processor must remain within the minimum and maximum case temperature (T

CASE

) specifications 

as defined by the applicable thermal profile (see 

). Thermal solutions not 

designed to provide this level of thermal capability may affect the long-term reliability of the 
processor and system. For more details on thermal solution design, please refer to the appropriate 
processor thermal/mechanical design guideline.

The Dual-Core Intel Xeon processor 7000 series introduces a new methodology for managing 
processor temperatures which is intended to support acoustic noise reduction through fan speed 
control and assure processor reliability. Selection of the appropriate fan speed will be based on the 
temperature reported by the processor’s Thermal Diode. If the diode temperature is greater than or 
equal to Tcontrol (see 

), then the processor case temperature must remain at or below 

the temperature as specified by the thermal profile (see 

). If the diode temperature is less 

than Tcontrol, then the case temperature is permitted to exceed the thermal profile, but the diode 
temperature must remain at or below Tcontrol. Systems that implement fan speed control must be 
designed to take these conditions into account. Systems that do not alter the fan speed only need to 
guarantee the case temperature meets the thermal profile specifications.

The Dual-Core Intel Xeon processor 7000 series thermal profile ensures adherence to Intel 
reliability requirements. The thermal profile is representative of a volumetrically unconstrained 
thermal solution (i.e. industry enabled 2U heatsink). In this scenario, it is expected that the Thermal 
Control Circuit (TCC) would only be activated for very brief periods of time when running the 
most power intensive applications. Refer to the Dual-Core Intel

Thermal/Mechanical Design Guidelines for details on system thermal solution design, thermal 
profiles, and environmental considerations.