Intel Xeon 7130N LF80550KF0878M Data Sheet

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The Dual-Core Intel Xeon processor 7000 series will be offered as an Intel boxed processor. Intel 
boxed processors are intended for system integrators who build systems from components 
available through distribution channels. The boxed thermal solution is under development and is 
subject to change. This section is meant to provide some insight into the current direction of the 
thermal solution. Future revisions may have solutions that differ from those discussed here.

The current thermal solution plan for the boxed Dual-Core Intel Xeon processor 7000 series is to 
include an unattached passive heatsink. This solution is currently targeted at chassis which are 3U 
and above in height. 

This section documents baseboard and platform requirements for the thermal solution, supplied 
with the boxed Dual-Core Intel Xeon processor 7000 series. This section is particularly important 
to companies that design and manufacture baseboards, chassis and complete systems. 

 

shows the conceptual drawing of the boxed processor thermal solution.

Drawings in this section reflect only the specifications on the Intel boxed processor product. These 
dimensions should not be used as a generic keepout zone for all cooling solutions. It is the system 
designer’s responsibility to consider their proprietary cooling solution when designing to the 
required keepout zone on their system platform and chassis.