Intel 2 Duo U7500 LE80537UE0042ML User Manual
Product codes
LE80537UE0042ML
Datasheet
83
Thermal Specifications and Design Considerations
NOTES:
1.
1.
The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
not the maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum T
Monitor’s automatic mode is used to indicate that the maximum T
J
has been reached.
Refer to
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specifications.
within specifications.
5.
4-M cache.
6.
2-M cache.
7.
At Tj of 100°C.
8.
At Tj of 50°C.
9.
At Tj of 35°C.
Table 18.
Power Specifications for the Dual-core Low Voltage Processor
Symbol
Processor
Number
Core Frequency &
Voltage
Thermal Design
Power
Unit
Notes
TDP
L7400
L7200
L7200
1.50 GHz & HFM V
CC
1.33 GHz & HFM V
CC
1.00 GHz & LFM V
CC
17
17
17
15.1
W
1, 4, 7
Symbol
Parameter
Min
Typ
Max
Unit
P
AH,
P
SGNT
Auto Halt, Stop Grant Power
at HFM V
at HFM V
CC
at LFM V
CC
5.2
4.6
4.6
W
2, 8
P
SLP
Sleep Power
at HFM V
at HFM V
CC
at LFM V
CC
4.9
4.4
4.4
W
2, 8
P
DSLP
Deep Sleep Power
at HFM V
at HFM V
CC
at LFM V
CC
2.9
2.8
2.8
W
2, 9
P
DPRSLP
Deeper Sleep Power
1.5
W
2, 9
P
DC4
Intel Enhanced Deeper Sleep Power
0.9
W
2, 9
T
J
Junction Temperature
0
100
°C
3, 4