Intel QX6700 HH80562PH0678M User Manual
Product codes
HH80562PH0678M
6
Datasheet
Tables
Voltage Identification Definition..................................................................................15
Absolute Maximum and Minimum Ratings ....................................................................17
Static and Transient Tolerance .............................................................................19
Overshoot Specifications......................................................................................21
Signal Characteristics................................................................................................23
10 GTL+ Signal Group DC Specifications ..........................................................................24
11 Open Drain and TAP Output Signal Group DC Specifications ...........................................24
12 CMOS Signal Group DC Specifications..........................................................................25
13 PECI DC Electrical Limits ...........................................................................................25
14 GTL+ Bus Voltage Definitions .....................................................................................26
15 Core Frequency to FSB Multiplier Configuration.............................................................26
16 BSEL[2:0] Frequency Table for BCLK[1:0] ...................................................................27
17 Front Side Bus Differential BCLK Specifications .............................................................28
18 FSB Differential Clock Specifications (1066 MHz FSB) ....................................................28
19 FSB Differential Clock Specifications (1333 MHz FSB) ....................................................29
20 Processor Loading Specifications.................................................................................35
21 Package Handling Guidelines......................................................................................35
22 Processor Materials...................................................................................................36
23 Alphabetical Land Assignments...................................................................................42
24 Numerical Land Assignment .......................................................................................52
25 Signal Description.....................................................................................................62
26 Processor Thermal Specifications ................................................................................72
27 Thermal Profile for 130 W Processors ..........................................................................73
28 Thermal Profile for 105 W Processors ..........................................................................74
29 Thermal Profile 95 W Processors.................................................................................75
30 GetTemp0() and GetTemp1() Error Codes....................................................................81
31 Power-On Configuration Option Signals .......................................................................83
32 Fan Heatsink Power and Signal Specifications...............................................................91
33 Fan Heatsink Power and Signal Specifications...............................................................95
11 Open Drain and TAP Output Signal Group DC Specifications ...........................................24
12 CMOS Signal Group DC Specifications..........................................................................25
13 PECI DC Electrical Limits ...........................................................................................25
14 GTL+ Bus Voltage Definitions .....................................................................................26
15 Core Frequency to FSB Multiplier Configuration.............................................................26
16 BSEL[2:0] Frequency Table for BCLK[1:0] ...................................................................27
17 Front Side Bus Differential BCLK Specifications .............................................................28
18 FSB Differential Clock Specifications (1066 MHz FSB) ....................................................28
19 FSB Differential Clock Specifications (1333 MHz FSB) ....................................................29
20 Processor Loading Specifications.................................................................................35
21 Package Handling Guidelines......................................................................................35
22 Processor Materials...................................................................................................36
23 Alphabetical Land Assignments...................................................................................42
24 Numerical Land Assignment .......................................................................................52
25 Signal Description.....................................................................................................62
26 Processor Thermal Specifications ................................................................................72
27 Thermal Profile for 130 W Processors ..........................................................................73
28 Thermal Profile for 105 W Processors ..........................................................................74
29 Thermal Profile 95 W Processors.................................................................................75
30 GetTemp0() and GetTemp1() Error Codes....................................................................81
31 Power-On Configuration Option Signals .......................................................................83
32 Fan Heatsink Power and Signal Specifications...............................................................91
33 Fan Heatsink Power and Signal Specifications...............................................................95