Intel QX6700 HH80562PH0678M User Manual
Product codes
HH80562PH0678M
Thermal Specifications and Design Considerations
72
Datasheet
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
. In all cases the Thermal Monitor and
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
Table 26.
Processor Thermal Specifications
Processor
Number
Core
Frequency
(GHz)
Thermal
Design
Power (W)
Extended
HALT Power
(W)
1
NOTES:
1.
Specification is at 50 °C T
C
and typical voltage loadline.
775_VR_
CONFIG_05A
/B Guidance
2
2. 775_VR_CONFIG_05B guidelines provide a design target for meeting future thermal requirements.
Minimum
T
C
(°C)
Maximum
T
C
(°C)
Notes
QX6850
3.00
130
37
775_VR_CONF
IG_05B
5
See
3, 4
3.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not
the maximum power that the processor can dissipate.
4.
This table shows the maximum TDP for a given frequency range. Individual processors may have a lower
TDP. Therefore, the maximum T
C
will vary depending on the TDP of the individual processor. Refer to
thermal profile figure and associated table for the allowed combinations of power and T
C
.
QX6800
2.93
130
37
5
QX6700
2.66
130
50
5
Q6700
2.66
95
24
775_VR_CONF
IG_05A
5
See
Q6600
2.40
105
50
775_VR_CONF
IG_05B
5
See
5. These processors have CPUID = 06F7h
Q6600
2.40
95
24
775_VR_CONF
IG_05A
5
See
6. These processors have CPUID = 06FBh