Intel D525 AU80610006225AA User Manual

Product codes
AU80610006225AA
Page of 79
Functional Description
30
Datasheet
3.1.2.2
DDR3 (SO-DIMM Only)
The system memory controller supports the following DDR3 data transfer rates, SO-
DIMM modules and DRAM device technologies: 
DDR3 data transfer rate of 800 MT/s
DDR3 SO-DIMM modules (unbuffered, non-ECC)
— Raw card A = 2 ranks of x16 SDRAMs (double sided)
— Raw card B = 1 rank of x8 SDRAM (double sided)
Note:
x16/x8 means that each SDRAM component has 16/8 data lines.
— DDR3 DRAM Device Technology:
Standard 1-Gb and 2-Gb technologies and addressing are supported for x16/x8 
devices. There is no support for SO-DIMMs with different technologies or 
capacities on opposite sides of the same SO-DIMM. If one side of a SO-DIMM is 
populated, the other side is either identical or empty.
— Supported DDR3 SO-DIMM module configurations
3.1.3
Rules for Populating DIMM Slots
The frequency of system memory will be the lowest frequency of all DIMMs in the 
system, as determined through the SPD registers on the DIMMs. Timing parameters 
[CAS latency (or CL + AL for DDR2), tRAS, tRCD, tRP] must be programmed to match 
within a channel.
In single channel mode, any DIMM slot within the channel may be populated in any 
order. To take advantage of enhanced addressing, it is best to populate both DIMM slots 
with identical DIMMs. 
3.2
Graphics Processing Unit
This section details the integrated graphics engines (3D, 2D and video), 3D pipeline, 
and the respective capabilities.
The CPU’s graphics processing unit (GPU) contains several types of components. The 
major components in the GPU are the engines, planes, pipes and ports. The GPU has a 
3D/2D instruction processing unit to control the 3D and 2D engines respectively. The 
Raw Card 
Type
DIMM 
Capacity
DRAM 
Device 
Tech.
DRAM 
Organization
# of 
DRAM 
Devices
# of 
Ranks
# of 
Banks
A
1 GB
1 Gb
64 M x16
8
2
8
A
2 GB
2 Gb
128 M x16
8
2
8
B
1 GB
1 Gb
128 M x8
8
1
8
B
2 GB
2 Gb
256 M x8
8
1
8