Intel D525 AU80610006225AA User Manual
Product codes
AU80610006225AA
Datasheet
59
Thermal Specifications and Design Considerations
NOTES:
1.
1.
The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
not the maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specifications.
within specifications.
4.
V
CC
is determined by processor VID[6:0].
5.
Silicon projection.
The processor incorporates 3 methods of monitoring die temperature: Digital Thermal
Sensor, Intel Thermal Monitor, and the Thermal Diode. The Intel Thermal Monitor
(detailed in Section
Sensor, Intel Thermal Monitor, and the Thermal Diode. The Intel Thermal Monitor
(detailed in Section
) must be used to determine when the maximum
specified processor junction temperature has been reached.
7.1.1
Thermal Diode
The processor incorporates an on-die PNP transistor whose base emitter junction is
used as a thermal “diode”, with its collector shorted to ground. The thermal diode can
be read by an off-die analog/digital converter (a thermal sensor) located on the
motherboard or a stand-alone measurement kit. The thermal diode may be used to
monitor the die temperature of the processor for thermal management or
instrumentation purposes but is not a reliable indication that the maximum operating
temperature of the processor has been reached. When using the thermal diode, a
temperature offset value must be read from a processor MSR and applied. See
used as a thermal “diode”, with its collector shorted to ground. The thermal diode can
be read by an off-die analog/digital converter (a thermal sensor) located on the
motherboard or a stand-alone measurement kit. The thermal diode may be used to
monitor the die temperature of the processor for thermal management or
instrumentation purposes but is not a reliable indication that the maximum operating
temperature of the processor has been reached. When using the thermal diode, a
temperature offset value must be read from a processor MSR and applied. See
for more details. See Section
for thermal diode usage
recommendation when the PROCHOT# signal is not asserted.
The reading of the external thermal sensor (on the motherboard) connected to the
processor thermal diode signals will not necessarily reflect the temperature of the
hottest location on the die. This is due to inaccuracies in the external thermal sensor,
on-die temperature gradients between the location of the thermal diode and the hottest
processor thermal diode signals will not necessarily reflect the temperature of the
hottest location on the die. This is due to inaccuracies in the external thermal sensor,
on-die temperature gradients between the location of the thermal diode and the hottest
Table 7-46.Power Specifications for the Standard Voltage Processor
Symbol
Processor
Number
Core
Frequency
Thermal Design
Power
Unit
Tj
min
(°C)
Tj
max
(°C)
(°C)
Notes
TDP
D510
D410
D525
D425
D410
D525
D425
1.66
1.66
1.80
1.80
1.66
1.80
1.80
<=13
<=10
<=13
<=10
<=10
<=13
<=10
W
W
W
W
W
W
W
0
100
100
100
1, 3, 4,
5
Symbol
Parameter
Min
Typ
Max
Unit
P
IDLE
Idle Power D510
Idle Power D410
Idle Power D525
Idle Power D425
Idle Power D410
Idle Power D525
Idle Power D425
4.5
3.8
4.8
4.0
3.8
4.8
4.0
W
W
W
W
W
W
W
2