Intel D525 AU80610006225AA User Manual
Product codes
AU80610006225AA
Introduction
8
Datasheet
1
Introduction
The Intel® Atom™ Processor D400 and D500 Series processors are built on 45-
nanometer Hi-K process technology. The processor is designed for a two-chip platform
as opposed to the traditional three-chip platforms (processor, GMCH, and ICH). The
two-chip platform consists of a processor and the chipset and enables higher
performance, lower cost, easier validation, and improved x-y footprint.
nanometer Hi-K process technology. The processor is designed for a two-chip platform
as opposed to the traditional three-chip platforms (processor, GMCH, and ICH). The
two-chip platform consists of a processor and the chipset and enables higher
performance, lower cost, easier validation, and improved x-y footprint.
Note:
Throughout this document, Intel® Atom™ Processor D400 and D500 Series is referred
to as processor and Intel® NM10 Express Chipset is referred to as chipset.
to as processor and Intel® NM10 Express Chipset is referred to as chipset.
Included in this family of processors is an integrated memory controller (IMC),
integrated graphics processing unit (GPU) and integrated I/O (IIO) (such as DMI) on a
single silicon die. This single die solution is known as a monolithic processor.
integrated graphics processing unit (GPU) and integrated I/O (IIO) (such as DMI) on a
single silicon die. This single die solution is known as a monolithic processor.
1.1
Intel® Atom™ Processor D400 and D500 Series
Features
The following list provides some of the key features on this processor:
•
On die, primary 32-kB instructions cache and 24-kB write-back data cache
•
Intel
®
Hyper-Threading Technology 2-threads per core
•
On die 2 x 512-kB, 8-way L2 cache for D510 dual-core processor, 1 x 512-kB, 8-
way L2 cache for D410 single-core processor
way L2 cache for D410 single-core processor
•
Support for IA 32-bit
•
Intel
®
Streaming SIMD Extensions 2 and 3 (SSE2 and SSE3) and Supplemental
Streaming SIMD Extensions 3 (SSSE3) support
•
Intel
®
64 architecture
•
Micro-FCBGA8 packaging technologies
•
Thermal management support via Intel® Thermal Monitor (TM1)
•
Supports C0 and C1 states only
•
Execute Disable Bit support for enhanced security