Intel Xeon L5318 HH80563JH0258MT Data Sheet
Product codes
HH80563JH0258MT
Thermal Specifications
88
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
power-intensive applications. Refer to the Quad-Core Intel® Xeon® Processor 5300
Series Thermal/Mechanical Design Guidelinesfor details on system thermal solution
design, thermal profiles and environmental considerations.
Series Thermal/Mechanical Design Guidelinesfor details on system thermal solution
design, thermal profiles and environmental considerations.
For the Quad-Core Intel® Xeon® Processor X5300 Series, Intel has developed two
thermal profiles, either of which can be implemented. Both ensure adherence to Intel
reliability requirements. Thermal Profile A (see
thermal profiles, either of which can be implemented. Both ensure adherence to Intel
reliability requirements. Thermal Profile A (see
) is representative
of a volumetrically unconstrained thermal solution (that is, industry enabled 2U
heatsink). In this scenario, it is expected that the Thermal Control Circuit (TCC) would
only be activated for very brief periods of time when running the most power intensive
applications. Thermal Profile B (see
heatsink). In this scenario, it is expected that the Thermal Control Circuit (TCC) would
only be activated for very brief periods of time when running the most power intensive
applications. Thermal Profile B (see
) is indicative of a constrained
thermal environment (that is, 1U form factor). Because of the reduced cooling
capability represented by this thermal solution, the probability of TCC activation and
performance loss is increased. Additionally, utilization of a thermal solution that does
not meet Thermal Profile B will violate the thermal specifications and may result in
permanent damage to the processor. Refer to the Quad-Core Intel® Xeon® Processor
5300 Series Thermal/Mechanical Design Guidelines for details on system thermal
solution design, thermal profiles and environmental considerations.
capability represented by this thermal solution, the probability of TCC activation and
performance loss is increased. Additionally, utilization of a thermal solution that does
not meet Thermal Profile B will violate the thermal specifications and may result in
permanent damage to the processor. Refer to the Quad-Core Intel® Xeon® Processor
5300 Series Thermal/Mechanical Design Guidelines for details on system thermal
solution design, thermal profiles and environmental considerations.
The upper point of the thermal profile consists of the Thermal Design Power (TDP) and
the associated T
the associated T
CASE
value. It should be noted that the upper point associated with the
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile B (x = TDP and y =
T
T
CASE_MAX_B
@ TDP) represents a thermal solution design point. In actuality the
processor case temperature will not reach this value due to TCC activation (see
for Quad-Core Intel® Xeon® Processor X5300 Series). The lower point of
the thermal profile consists of x = P
_PROFILE_MIN
and y = T
CASE_MAX
@ P
_PROFILE_MIN
.
P
_PROFILE_MIN
is defined as the processor power at which T
CASE
, calculated from the
thermal profile, is equal to 50°C.
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP), instead of
the maximum processor power consumption. The Thermal Monitor feature is intended
to help protect the processor in the event that an application exceeds the TDP
recommendation for a sustained time period. For more details on this feature, refer to
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP), instead of
the maximum processor power consumption. The Thermal Monitor feature is intended
to help protect the processor in the event that an application exceeds the TDP
recommendation for a sustained time period. For more details on this feature, refer to
. To ensure maximum flexibility for future requirements, systems should be
designed to the Flexible Motherboard (FMB) guidelines, even if a processor with lower
power dissipation is currently planned. Thermal Monitor 1 and Thermal Monitor 2
feature must be enabled for the processor to remain within its specifications.
power dissipation is currently planned. Thermal Monitor 1 and Thermal Monitor 2
feature must be enabled for the processor to remain within its specifications.
Intel has developed thermal profiles specific to enable the Dual-Core Intel® Xeon®
Processor LV 5318, to be used in environments compliant with NEBS* Level 3 ambient
operating temperature requirements. At a minimum, NEBS Level 3 requires a nominal
ambient operating temperature of 40°C, with short-term excursions to 55°C. “Short-
term” is defined as a maximum of 96 hours per instance, for a total maximum of 360
hours per year, and a maximum of 15 instances per year.
Processor LV 5318, to be used in environments compliant with NEBS* Level 3 ambient
operating temperature requirements. At a minimum, NEBS Level 3 requires a nominal
ambient operating temperature of 40°C, with short-term excursions to 55°C. “Short-
term” is defined as a maximum of 96 hours per instance, for a total maximum of 360
hours per year, and a maximum of 15 instances per year.
To comply with these ambient operating temperature requirements, Intel has
developed a corresponding Nominal Thermal Profile and Short-Term Thermal Profile.
For normal operation, the processor must remain within the minimum and maximum
case temperature (T
developed a corresponding Nominal Thermal Profile and Short-Term Thermal Profile.
For normal operation, the processor must remain within the minimum and maximum
case temperature (T
CASE
) specifications as defined by the Nominal Thermal Profile. For
short-term operating conditions (maximum 96 hours per instance, maximum 360 hours
per year, maximum of 15 instances per year), the processor may remain within the
minimum and maximum T
per year, maximum of 15 instances per year), the processor may remain within the
minimum and maximum T
CASE
, as defined by the Short-Term Thermal Profile. For
environments that do not require NEBS Level 3 compliance, the processor must always
remain within the minimum and maximum case temperature (T
remain within the minimum and maximum case temperature (T
CASE
) specifications as
defined by the Nominal Thermal Profile.