Intel 9130M NE80567KF0288M User Manual
Product codes
NE80567KF0288M
Intel
®
Itanium
®
Processor 9300 Series Datasheet
81
Mechanical Specifications
4
Mechanical Specifications
The Intel Itanium processor 9300 series is packaged in a FC-LGA package that
interfaces with the motherboard via an LGA1248 socket. The package top side consists
of lands that interface with a LGA connector for direct power delivery to the core, cache
and system interface. The package also consists of an integrated heatsink spreader
(IHS), which is attached to the package substrate and die and serves as the mating
surface for the processor component thermal solutions, such as a heatsink. The bottom
side of the package has 1248 lands, a 38 x 38 mm pad array which interfaces with the
LGA1248 socket.
interfaces with the motherboard via an LGA1248 socket. The package top side consists
of lands that interface with a LGA connector for direct power delivery to the core, cache
and system interface. The package also consists of an integrated heatsink spreader
(IHS), which is attached to the package substrate and die and serves as the mating
surface for the processor component thermal solutions, such as a heatsink. The bottom
side of the package has 1248 lands, a 38 x 38 mm pad array which interfaces with the
LGA1248 socket.
shows a sketch of the processor package components and
how they are assembled together.
The package components shown in
1. Integrated Heat Spreader (IHS).
2. Processor die.
3. Internal test pads for power delivery.
4. LGA lands for I/O.
5. Decoupling and server management components.
6. LGA lands for power delivery.
2. Processor die.
3. Internal test pads for power delivery.
4. LGA lands for I/O.
5. Decoupling and server management components.
6. LGA lands for power delivery.
Note:
This drawing is not to scale and is for reference only. Processor power delivery and thermal solutions,
and the socket are not shown.
Figure 4-1. Processor Package Assembly Sketch
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