Intel Itanium 9140M NE80567KF028009 User Manual

Product codes

NE80567KF028009

Dual-Core Intel

Itanium

Processor 9000 and 9100 Series Datasheet

Contents

Introduction............................................................................................................... 11
1.1

Overview ......................................................................................................... 11

1.2

Processor Abstraction Layer ................................................................................ 11

1.3

Mixing Processors of Different Frequencies and Cache Sizes .................................... 12

1.4

Terminology ..................................................................................................... 12

1.5

State of Data .................................................................................................... 12

1.6

Reference Documents ........................................................................................ 13

Electrical Specifications ............................................................................................... 15
2.1

Dual-Core Intel

Itanium

Processor 9000 and 9100 Series System Bus .................. 15

2.1.1

System Bus Power Pins ........................................................................ 15

2.1.2

System Bus No Connect ....................................................................... 15

2.2

System Bus Signals ........................................................................................... 15
2.2.1

Signal Groups ..................................................................................... 15

2.2.2

Signal Descriptions .............................................................................. 17

2.3

Package Specifications ....................................................................................... 18

2.4

Signal Specifications .......................................................................................... 18
2.4.1

Maximum Ratings ................................................................................ 22

2.5

System Bus Signal Quality Specifications and Measurement Guidelines ..................... 23
2.5.1

Overshoot/Undershoot Magnitude .......................................................... 23

2.5.2

Overshoot/Undershoot Pulse Duration .................................................... 24

2.5.3

Activity Factor..................................................................................... 24

2.5.4

Reading Overshoot/Undershoot Specification Tables ................................. 24

2.5.5

Determining if a System Meets the Overshoot/Undershoot

Specifications...................................................................................... 25

2.5.6

Wired-OR Signals ................................................................................ 25

2.6

Voltage Regulator Connector Signals.................................................................... 27

2.7

System Bus Clock and Processor Clocking............................................................. 31

2.8

Pinout Specifications ................................................................................................... 35

Mechanical Specifications............................................................................................. 65
4.1

Processor Package Dimensions............................................................................ 65
4.1.1

Voltage Regulator (MVR) to Processor Package Interface........................... 71

4.2

Package Marking ............................................................................................... 72
4.2.1

Processor Top-Side Marking .................................................................. 72

4.2.2

Processor Bottom-Side Marking ............................................................. 73

Thermal Specifications ................................................................................................ 75
5.1

Thermal Features .............................................................................................. 75
5.1.1

Thermal Alert...................................................................................... 75

5.1.2

Enhanced Thermal Management ............................................................ 76

5.1.3

Power Trip .......................................................................................... 76

5.1.4

Thermal Trip ....................................................................................... 76

5.2

Case Temperature ............................................................................................. 76

System Management Feature Specifications ................................................................... 79
6.1

System Management Bus ................................................................................... 79
6.1.1

System Management Bus Interface ........................................................ 79

6.1.2

System Management Interface Signals ................................................... 79

6.1.3

SMBus Device Addressing ..................................................................... 81

6.2

Processor Information ROM ................................................................................ 82

6.3

Scratch EEPROM ............................................................................................... 85