Intel L5238 EU80573JJ0676M Data Sheet

29

1.

Unless otherwise noted, all specifications in this table are based on final silicon characterization data.

2.

These voltages are targets only. A variable voltage source should exist on systems in the event that a 

different voltage is required. See 

 for more information.

3.

The voltage specification requirements are measured across the VCC_DIE_SENSE and VSS_DIE_SENSE 

lands and across the VCC_DIE_SENSE2 and VSS_DIE_SENSE2 lands with an oscilloscope set to 100 MHz 

bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of 

ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled 

in the scope probe. 

4.

The processor must not be subjected to any static V

CC

 level that exceeds the V

CC_MAX

 associated with any 

particular current. Failure to adhere to this specification can shorten processor lifetime.

5.

I

CC_MAX

 specification is based on maximum V

CC 

loadline. Refer to 

, and 

 

for details. The processor is capable of drawing I

CC_MAX 

for up to 10 ms. Refer to 

 for further 

details on the average processor current draw over various time durations.

6.

FMB is the flexible motherboard guideline. These guidelines are for estimation purposes only. See 

 for further details on FMB guidelines.

7.

This specification represents the total current for GTLREF_DATA and GTLREF_ADD.

8.

V

TT

 must be provided via a separate voltage source and must not be connected to V

CC

. This specification is 

measured at the land.

9.

Minimum V

CC

 and maximum I

CC

 are specified at the maximum processor case temperature (TCASE) shown 

in 

 and 

.

I

CC_TDC

Thermal Design Current 

(TDC) Dual-Core Intel® 

Xeon® Processor X5200 

Series
Launch - FMB

70

A

6,14

I

CC_TDC

Thermal Design Current 

(TDC) Dual-Core Intel® 

Xeon® Processor E5200 

Series
Launch - FMB

60

A

6,14

I

CC_TDC

Thermal Design Current 

(TDC) Dual-Core Intel® 

Xeon® Processor L5200 

Series
Launch - FMB

38

A

6,14

I

CC_TDC

Thermal Design Current 

(TDC) Dual-Core Intel® 

Xeon® Processor L5238
Launch - FMB

35

A

6,14

I

CC_VTT_OUT

DC current that may be 

drawn from V

TT_OUT 

per land 

580

mA

16

I

CC_GTLREF

I

CC

 for 

GTLREF_DATA and 

GTLREF_ADD

200

µA

7

I

CC_VCCPLL

I

CC

 for PLL supply

130

mA

12

I

TCC

I

CC 

for Dual-Core Intel® 

Xeon® Processor X5200 

Series during active thermal 

control circuit (TCC)

90

A

I

TCC

I

CC 

for Dual-Core Intel® 

Xeon® Processor E5200 

Series during active thermal 

control circuit (TCC)

75

A

I

TCC

I

CC 

for Dual-Core Intel® 

Xeon® Processor L5200 

Series during active thermal 

control circuit (TCC)

50

A

I

TCC

I

CC 

for Dual-Core Intel® 

Xeon® Processor L5238 

during active thermal control 

circuit (TCC)

42

A