Intel 2 Duo T5600 LE80537GF0342M User Manual

Datasheet

81

The processor requires a thermal solution to maintain temperatures within operating 

limits as set forth in 

. Any attempt to operate the processor outside these 

operating limits may result in permanent damage to the processor and potentially other 

components in the system. As processor technology changes, thermal management 

becomes increasingly crucial when building computer systems. Maintaining the proper 

thermal environment is key to reliable, long-term system operation. A complete 

thermal solution includes both component and system level thermal management 

features. Component level thermal solutions include active or passive heatsinks or heat 

exchangers attached to the exposed processor die. The solution should make firm 

contact to the die while maintaining processor mechanical specifications such as 

pressure. A typical system level thermal solution may consist of a processor fan ducted 

to a heat exchanger that is thermally-coupled to the processor via a heat pipe or direct 

die attachment. A secondary fan or air from the processor fan may also be used to cool 

other platform components or to lower the internal ambient temperature within the 

system.

To allow for the optimal operation and long-term reliability of Intel processor-based 

systems, the system/processor thermal solution should be designed such that the 

processor remains within the minimum and maximum junction temperature (Tj) 

specifications at the corresponding thermal design power (TDP) value listed in 

Thermal solutions not designed to provide this level of thermal capability may affect the 

long-term reliability of the processor and system.

The maximum junction temperature is defined by an activation of the processor Intel 

Thermal Monitor. Refer to 

 for more details. Analysis indicates that real 

applications are unlikely to cause the processor to consume the theoretical maximum 

power dissipation for sustained time periods. Intel recommends that complete thermal 

solution designs target the TDP indicated in 

. The Intel Thermal Monitor feature 

is designed to help protect the processor in the unlikely event that an application 

exceeds the TDP recommendation for a sustained period of time. For more details on 

the usage of this feature, refer to 

. In all cases, the Intel Thermal Monitor 

feature must be enabled for the processor to remain within specification.