Intel E7310 LF80565QH0254M Data Sheet
Product codes
LF80565QH0254M
Document Number: 318080-002
141
Debug Tools Specifications
9
Debug Tools Specifications
9.1
Debug Port System Requirements
The Intel
®
Xeon
®
Processor 7200 Series and 7300 Series debug port is the command
and control interface for the In-Target Probe (ITP) debugger. The ITP enables run-time
control of the processors for system debug. The debug port, which is connected to the
FSB, is a combination of the system JTAG and execution signals. There are several
mechanical, electrical and functional constraints on the debug port that must be
followed. The mechanical constraint requires the debug port connector to be installed in
the system with adequate physical clearance. Electrical constraints exist due to the
mixed high and low speed signals of the debug port for the processor. While the JTAG
signals operate at a maximum of 75 MHz, the execution signals operate at the common
clock FSB frequency. The functional constraint requires the debug port to use the JTAG
system via a handshake and multiplexing scheme.
control of the processors for system debug. The debug port, which is connected to the
FSB, is a combination of the system JTAG and execution signals. There are several
mechanical, electrical and functional constraints on the debug port that must be
followed. The mechanical constraint requires the debug port connector to be installed in
the system with adequate physical clearance. Electrical constraints exist due to the
mixed high and low speed signals of the debug port for the processor. While the JTAG
signals operate at a maximum of 75 MHz, the execution signals operate at the common
clock FSB frequency. The functional constraint requires the debug port to use the JTAG
system via a handshake and multiplexing scheme.
In general, the information in this chapter may be used as a basis for including all run-
control tools in Intel
control tools in Intel
®
Xeon
®
Processor 7200 Series and 7300 Series-based systems
designs including tools from vendors other than Intel.
Note:
The debug port and JTAG signal chain must be designed into the processor board to
utilize the XDP for debug purposes except for interposer solutions.
9.2
Logic Analyzer Interface (LAI)
Intel is working with two logic analyzer vendors to provide logic analyzer interfaces
(LAIs) for use in debugging Intel
(LAIs) for use in debugging Intel
®
Xeon
®
Processor 7200 Series and 7300 Series
systems. Tektronix and Agilent should be contacted to obtain specific information about
their logic analyzer interfaces. The following information is general in nature. Specific
information must be obtained from the logic analyzer vendor.
their logic analyzer interfaces. The following information is general in nature. Specific
information must be obtained from the logic analyzer vendor.
Due to the complexity of Intel
®
Xeon
®
Processor 7200 Series and 7300 Series-based
multiprocessor systems, the LAI is critical in providing the ability to probe and capture
FSB signals. There are two sets of considerations to keep in mind when designing a
Intel
FSB signals. There are two sets of considerations to keep in mind when designing a
Intel
®
Xeon
®
Processor 7200 Series and 7300 Series-based system that can make use
of an LAI: mechanical and electrical.
9.2.1
Mechanical Considerations
The LAI is installed between the processor socket and the processor. The LAI plugs into
the socket, while the processor plugs into a socket on the LAI. Cabling that is part of
the LAI egresses the system to allow an electrical connection between the processor
and a logic analyzer. The maximum volume occupied by the LAI, known as the keepout
volume, as well as the cable egress restrictions, should be obtained from the logic
analyzer vendor. System designers must make sure that the keepout volume remains
unobstructed inside the system. In some cases, it is known that some of the electrolytic
capacitors fall inside of the keepout volume for the LAI. In this case, it is necessary to
move these capacitors to the backside of the board before using the LAI. Additionally,
note that it is possible that the keepout volume reserved for the LAI may include
different requirements from the space normally occupied by the heatsink. If this is the
case, the logic analyzer vendor will provide either a cooling solution as part of the LAI
or additional hardware to mount the existing cooling solution.
the socket, while the processor plugs into a socket on the LAI. Cabling that is part of
the LAI egresses the system to allow an electrical connection between the processor
and a logic analyzer. The maximum volume occupied by the LAI, known as the keepout
volume, as well as the cable egress restrictions, should be obtained from the logic
analyzer vendor. System designers must make sure that the keepout volume remains
unobstructed inside the system. In some cases, it is known that some of the electrolytic
capacitors fall inside of the keepout volume for the LAI. In this case, it is necessary to
move these capacitors to the backside of the board before using the LAI. Additionally,
note that it is possible that the keepout volume reserved for the LAI may include
different requirements from the space normally occupied by the heatsink. If this is the
case, the logic analyzer vendor will provide either a cooling solution as part of the LAI
or additional hardware to mount the existing cooling solution.