Intel E7310 LF80565QH0254M Data Sheet
Product codes
LF80565QH0254M
Document Number: 318080-002
97
Thermal Specifications
Notes:
1.
for discrete points that constitute the thermal profile.
2.
Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile will result in increased probability of TCC
activation and may incur measurable performance loss. (See
for details on TCC activation).
3.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
4.
These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
5.
Power specifications are defined at all VIDs found in
. The Quad-Core Intel® Xeon® E7300
Processor may be shipped under multiple VIDs for each frequency.
6.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Figure 6-1.Quad-Core Intel® Xeon® E7300 Processor Thermal Profile
Therm al Profile
20.0
30.0
40.0
50.0
60.0
70.0
0
10
20
30
40
50
60
70
80
Pow er(W)
Te
m
p
e
ra
tur
e
(
C
)
T
case
= 0.263 x Pow er + 45
Table 6-2.
Quad-Core Intel® Xeon® E7300 Processor Thermal Profile Table
Power (W)
T
CASE_MAX
(° C)
0
45.0
10
47.6
20
50.3
30
52.9
40
55.5
50
58.2
60
60.8
70
63.4
80
66.0