Intel LF80550KF100007 Data Sheet
Dual-Core Intel® Xeon® Processor 7100 Series Datasheet
117
Boxed Processor Specifications
8
Boxed Processor Specifications
8.1
Introduction
Intel boxed processors are intended for system integrators who build systems from
components available through distribution channels. Future revisions may have
solutions that differ from those discussed here.
components available through distribution channels. Future revisions may have
solutions that differ from those discussed here.
The thermal solution for the boxed Dual-Core Intel Xeon processor 7100 series, for
each processor frequency, includes an unattached passive heatsink. This solution is
targeted at chassis which are 3U and above in height.
each processor frequency, includes an unattached passive heatsink. This solution is
targeted at chassis which are 3U and above in height.
This section documents baseboard and platform requirements for the thermal solution,
supplied with the boxed Dual-Core Intel Xeon processor 7100 series. This section is
particularly important to companies that design and manufacture baseboards, chassis
and complete systems.
supplied with the boxed Dual-Core Intel Xeon processor 7100 series. This section is
particularly important to companies that design and manufacture baseboards, chassis
and complete systems.
processor thermal solution.
Drawings in this section reflect only the specifications on the Intel boxed processor
product. These dimensions should not be used as a generic keep-out zone for all
cooling solutions. It is the system designer’s responsibility to consider their proprietary
cooling solution when designing to the required keep-out zone on their system platform
and chassis.
product. These dimensions should not be used as a generic keep-out zone for all
cooling solutions. It is the system designer’s responsibility to consider their proprietary
cooling solution when designing to the required keep-out zone on their system platform
and chassis.