Intel LF80550KF100007 Data Sheet

Dual-Core Intel® Xeon® Processor 7100 Series Datasheet

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The boxed processor heatsink weight is approximately 530 grams. See 

document for details on the processor weight and the Dual-Core Intel® Xeon® 
Processor 7100 Series Thermal/Mechanical Design Guidelines for the enabled heatsink 
requirements.

Baseboards and chassis’s designed for use by system integrators should include holes 
that are in proper alignment with each other to support the boxed processor. See 

 for example of processor pitch and layout.

 illustrates the retention solution. This is designed to extend air-cooling 

capability through the use of larger heatsinks with minimal airflow blockage and 
minimal bypass. These retention mechanisms can allow the use of much heavier 
heatsink masses compared to legacy solution limitations by using a load path attached 
to the chassis pan. The CEK spring on the under side of the baseboard provides the 
necessary compressive load for the thermal interface material. The baseboard is 
intended to be isolated such that the dynamic loads from the heatsink are transferred 
to the chassis pan via the heatsink screws and heatsink standoffs. This reduces the risk 
of package pullout and solder joint failures in a shock and vibe situation.

The assembly requires larger diameter holes to compensate for the CEK spring 
embosses. See 

 for processor mounting thru holes. For 

further details on the solution, refer to the Dual-Core Intel® Xeon® Processor 7100 
Series Thermal/Mechanical Design Guidelines.

This section describes the cooling requirements of the heatsink solution utilized by the 
boxed processor.

The boxed processor will be cooled by forcing ducted chassis fan airflow through the 
passive heat sink solution. Meeting the processor’s temperature specifications is a 
function of the thermal design of the entire system, and ultimately the responsibility of 
the system integrator. The processor temperature specification is found in 

 of 

this document. For the boxed processor passive heatsink to operate properly, chassis 
air movement devices are required. Necessary airflow and associated flow impedance is 
29 cfm at 0.14” H

2

O.

In addition, the processor pitch should be 3.25 inches, or slightly more, when placed in 
side by side orientation. 

 illustrates the side by side orientation and pitch. 

Note that the heatsinks are interleaved to reduce air bypass.

It is also recommended that the ambient air temperature outside of the chassis be kept 
at or below 35 °C. The air passing directly over the processor heatsink should not be 
preheated by other system components (such as another processor), and should be 
kept at or below 40 °C. Again, meeting the processor’s temperature specification is the 
responsibility of the system integrator.