Intel LF80550KF100007 Data Sheet
Dual-Core Intel® Xeon® Processor 7100 Series Datasheet
41
Mechanical Specifications
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Mechanical Specifications
The Dual-Core Intel Xeon processor 7100 series is packaged in a Flip-Chip Micro Pin
Grid Array 6 (FC-mPGA6) package that interfaces with the motherboard via a mPGA604
socket. The package consists of a processor core mounted on a substrate pin-carrier.
An integrated heat spreader (IHS) is attached to the package substrate and core and
serves as the mating surface for processor component thermal solutions, such as a
heatsink.
Grid Array 6 (FC-mPGA6) package that interfaces with the motherboard via a mPGA604
socket. The package consists of a processor core mounted on a substrate pin-carrier.
An integrated heat spreader (IHS) is attached to the package substrate and core and
serves as the mating surface for processor component thermal solutions, such as a
heatsink.
shows a sketch of the processor package components and how
they are assembled together. Refer to the mPGA604 Socket Design Guidelines for
complete details on the mPGA604 socket.
complete details on the mPGA604 socket.
The package components shown in
1. Integrated Heat Spreader (IHS)
2. Processor die
3. FC-mPGA6 package
4. Pin-side capacitors
5. Package pin
2. Processor die
3. FC-mPGA6 package
4. Pin-side capacitors
5. Package pin
Note:
This drawing is not to scale and is for reference only. The mPGA604 socket is not
shown.
Figure 3-1. Processor Package Assembly Sketch
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