Intel LF80550KF100007 Data Sheet

Dual-Core Intel® Xeon® Processor 7100 Series Datasheet

45

The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into 
the required keep-out zones. Decoupling capacitors are typically mounted to either the 
topside or pin-side of the package substrate. See 

 for keepout 

zones.

 provides dynamic and static load specifications for the processor package. 

These mechanical load limits should not be exceeded during heatsink assembly, 
shipping conditions, or standard use condition. Also, any mechanical system or 
component testing should not exceed the maximum limits. The processor package 
substrate should not be used as a mechanical reference or load-bearing surface for 
thermal and mechanical solutions. The minimum loading specification must be 
maintained by any thermal and mechanical solution.

1.

These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top 

surface.

2.

This is the minimum and maximum static force that can be applied by the heatsink and retention solution 

to maintain the heatsink and processor interface.

3.

These parameters are based on limited testing for design characterization. Loading limits are for the 

package only and do not include the limits of the processor socket.

4.

This specification applies for thermal retention solutions that allow baseboard deflection.

5.

This specification applies either for thermal retention solutions that prevent baseboard deflection or for the 

Intel enabled reference solution (CEK).

6.

Dynamic loading is defined as an 11 ms duration average load superimposed on the static load 

requirement.

7.

Experimentally validated test condition used a heatsink mass of 1 lbm (~0.45 kg) with 100 G acceleration 

measured at heatsink mass. The dynamic portion of this specification in the product application can have 

flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this 

validated dynamic load (1 lbm x 100 G = 100 lb).

8.

Transient loading is defined as a 2 second duration peak load superimposed on the static load requirement, 

representative of loads experienced by the package during heatsink installation.

Static Compressive 

Load

44

10

222

50

N

lbf

1, 2, 3, 4

44

10

288

65

N

lbf

1, 2, 3, 5

Dynamic 

Compressive Load

222 N + 0.45 kg * 100 G

50 lbf (static) + 1 lbm * 100 G

N

lbf

1, 3, 4, 6, 7

288 N + 0.45 kg * 100 G

65 lbf (static) + 1 lbm * 100 G

N

lbf

1, 3, 5, 6, 7

Transient

445

100

N

lbf

1, 3, 8