Intel LF80550KF100007 Data Sheet
Dual-Core Intel® Xeon® Processor 7100 Series Datasheet
77
Thermal Specifications
6.1.2
Thermal Metrology
The maximum and minimum case temperatures (T
CASE
) specified in
are
measured at the geometric top center of the processor integrated heat spreader (IHS).
illustrates the location where T
CASE
temperature measurements should be
made. For detailed guidelines on temperature measurement methodology, refer to the
Dual-Core Intel® Xeon® Processor 7100 Series Thermal/Mechanical Design Guidelines.
Dual-Core Intel® Xeon® Processor 7100 Series Thermal/Mechanical Design Guidelines.
6.2
Processor Thermal Features
6.2.1
Thermal Monitor
The Thermal Monitor feature helps control the processor temperature by activating the
Thermal Control Circuit (TCC) when the processor silicon reaches its maximum
operating temperature. The TCC reduces processor power consumption as needed by
modulating (starting and stopping) the internal processor core clocks. The Thermal
Monitor (or Thermal Monitor 2) must be enabled for the processor to be operating
within specifications. The temperature at which Thermal Monitor activates the thermal
control circuit is not user configurable and is not software visible. Bus traffic is snooped
in the normal manner, and interrupt requests are latched (and serviced during the time
that the clocks are on) while the TCC is active.
Thermal Control Circuit (TCC) when the processor silicon reaches its maximum
operating temperature. The TCC reduces processor power consumption as needed by
modulating (starting and stopping) the internal processor core clocks. The Thermal
Monitor (or Thermal Monitor 2) must be enabled for the processor to be operating
within specifications. The temperature at which Thermal Monitor activates the thermal
control circuit is not user configurable and is not software visible. Bus traffic is snooped
in the normal manner, and interrupt requests are latched (and serviced during the time
that the clocks are on) while the TCC is active.
When the Thermal Monitor is enabled and a high temperature situation exists (i.e. TCC
is active), the clocks will be modulated by alternately turning the clocks off and on at a
duty cycle specific to the processor (typically 30-50%). Clocks will not be off for more
than 3 microseconds when the TCC is active. Cycle times are processor speed
dependent and will decrease as processor core frequencies increase. A small amount of
hysteresis has been included to prevent rapid active/inactive transitions of the TCC
when the processor temperature is near its maximum operating temperature. Once the
temperature has dropped below the maximum operating temperature and the
hysteresis timer has expired, the TCC goes inactive and clock modulation ceases.
is active), the clocks will be modulated by alternately turning the clocks off and on at a
duty cycle specific to the processor (typically 30-50%). Clocks will not be off for more
than 3 microseconds when the TCC is active. Cycle times are processor speed
dependent and will decrease as processor core frequencies increase. A small amount of
hysteresis has been included to prevent rapid active/inactive transitions of the TCC
when the processor temperature is near its maximum operating temperature. Once the
temperature has dropped below the maximum operating temperature and the
hysteresis timer has expired, the TCC goes inactive and clock modulation ceases.
Figure 6-3. Case Temperature (T
CASE
) Measurement Location
Measure T
CASE
at this point
(geometric center of IHS)
Thermal grease should cover
entire area of IHS
Measure from edge of IHS
53.34 mm FC-mPGA4 Package
19.2 mm [0.756 in]
19.2 mm [0.756 in]