Intel E8190 EU80570PJ0676MN User Manual
Product codes
EU80570PJ0676MN
Processor Thermal/Mechanical Information
24
Thermal and Mechanical Design Guidelines
2.4
System Thermal Solution Considerations
2.4.1
Chassis Thermal Design Capabilities
The Intel reference thermal solutions and Intel Boxed Processor thermal solutions
assume that the chassis delivers a maximum T
assume that the chassis delivers a maximum T
A
at the inlet of the processor fan
heatsink. The following tables show the T
A
requirements for the reference solutions
and Intel Boxed Processor thermal solutions.
Table 2–1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions
Topic
ATX E18764-001
1
BTX Type II
Heatsink Inlet Temperature
40° C
35.5° C
NOTE:
1.
Intel reference designs (E18764-001) for ATX assume the use of the thermally
advantaged chassis (refer to Thermally Advantaged Chassis (TAC) Design Guide for
TAC thermal and mechanical requirements). The TAC 2.0 Design Guide defines a new
processor cooling solution inlet temperature target of 40° C. The existing TAC 1.1
chassis can be compatible with TAC 2.0 guidelines.
advantaged chassis (refer to Thermally Advantaged Chassis (TAC) Design Guide for
TAC thermal and mechanical requirements). The TAC 2.0 Design Guide defines a new
processor cooling solution inlet temperature target of 40° C. The existing TAC 1.1
chassis can be compatible with TAC 2.0 guidelines.
Table 2–2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions
Topic
Boxed Processor for Intel
®
Core™2 Duo Processor
E8000, E7000 Series, Intel
®
Pentium
®
Dual-Core
Processor E6000, E5000 Series, and Intel
®
Celeron
®
Processor E3x00 Series
Heatsink Inlet Temperature
40° C
NOTE:
1.
Boxed Processor thermal solutions for ATX assume the use of the thermally advantaged
chassis (refer to Thermally Advantaged Chassis (TAC) Design Guide for TAC thermal
and mechanical requirements). The TAC 2.0 Design Guide defines a new processor
cooling solution inlet temperature target of 40° C. The existing TAC 1.1 chassis can be
compatible with TAC 2.0 guidelines.
chassis (refer to Thermally Advantaged Chassis (TAC) Design Guide for TAC thermal
and mechanical requirements). The TAC 2.0 Design Guide defines a new processor
cooling solution inlet temperature target of 40° C. The existing TAC 1.1 chassis can be
compatible with TAC 2.0 guidelines.
2.4.2
Improving Chassis Thermal Performance
The heat generated by components within the chassis must be removed to provide an
adequate operating environment for both the processor and other system
components. Moving air through the chassis brings in air from the external ambient
environment and transports the heat generated by the processor and other system
components out of the system. The number, size and relative position of fans and
vents determine the chassis thermal performance, and the resulting ambient
temperature around the processor. The size and type (passive or active) of the
thermal solution and the amount of system airflow can be traded off against each
other to meet specific system design constraints. Additional constraints are board
layout, spacing, component placement, acoustic requirements, and structural
considerations that limit the thermal solution size. For more information, refer to the
Performance ATX Desktop System Thermal Design Suggestions or Performance
microATX Desktop System Thermal Design Suggestions or Balanced Technology
Extended (BTX) System Design Guide documents available on the
adequate operating environment for both the processor and other system
components. Moving air through the chassis brings in air from the external ambient
environment and transports the heat generated by the processor and other system
components out of the system. The number, size and relative position of fans and
vents determine the chassis thermal performance, and the resulting ambient
temperature around the processor. The size and type (passive or active) of the
thermal solution and the amount of system airflow can be traded off against each
other to meet specific system design constraints. Additional constraints are board
layout, spacing, component placement, acoustic requirements, and structural
considerations that limit the thermal solution size. For more information, refer to the
Performance ATX Desktop System Thermal Design Suggestions or Performance
microATX Desktop System Thermal Design Suggestions or Balanced Technology
Extended (BTX) System Design Guide documents available on the
http://www.formfactors.org/
web site.