Intel LF80550KF0804M Data Sheet

Page of 128
Dual-Core Intel® Xeon® Processor 7100 Series Datasheet
81
Thermal Specifications
obtained by reading the IA32_TEMPERATURE_TARGET MSR in the processor. The 
T
CONTROL_OFFSET
 value that is read from the IA32_TEMPERATURE_TARGET MSR (1A2H) 
must be converted from Hexadecimal to Decimal and added to a T
CONTROL_BASE
 value of 
50°C for 150W TDP parts and added to a T
CONTROL_BASE
 value of 40°C for 95W TDP 
parts.
The Platform Id Bits located in the IA32_PLATFORM_ID MSR (17H) Bits[52:50] may be 
used by the BIOS to determine the TDP of the processor. A 150W TDP part has a 
Platform ID of ‘001’(Processor Flag 1) and a 95W TDP part has a Platform ID of ‘101’ 
(Processor Flag 5). Refer to the Cedar Mill Processor Family BIOS Writers Guide for 
specific register details.
The value of T
CONTROL_OFFSET
 may vary from 0x00h to 0x1Eh. Refer to the Cedar Mill 
Processor Family BIOS Writers Guide for specific register details.
When Tdiode is above T
CONTROL
, then T
CASE
 must be at or below T
CASE_MAX
 as defined 
by the thermal profile (see 
). 
Otherwise, the processor temperature can be maintained at T
CONTROL
.
6.2.8
Thermal Diode
The processor incorporates two on-die thermal diodes. A thermal sensor located on the 
processor package monitors the die temperature of the processor for thermal 
management/long term die temperature change purposes. The thermal diodes are 
separate from the Thermal Monitor’s thermal sensor and cannot be used to predict the 
behavior of the Thermal Monitor.
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