Intel 2 Duo T9400 AV80576GH0616M User Manual

Datasheet

51

The processor (XE and SV) is available in 478-pin Micro-FCPGA packages as well as 

479-ball Micro-FCBGA packages. The package mechanical dimensions are shown in 

 through 

The processor (POP, LV, ULV DC and ULV SC) is available 956-ball Micro-FCBGA 

packages. The package mechanical dimensions are shown in 

 and 

The maximum outgoing co-planarity is 0.2 mm (8 mils) for SFF processors.

The mechanical package pressure specifications are in a direction normal to the surface 

of the processor. This protects the processor die from fracture risk due to uneven die 

pressure distribution under tilt, stack-up tolerances and other similar conditions. These 

specifications assume that a mechanical attach is designed specifically to load one type 

of processor. 

A 15-lbf load limit should not be exceeded on BGA packages so as to not impact solder 

joint reliability after reflow. This load limit ensures that impact to the package solder 

joints due to transient bend, shock, or tensile loading is minimized. The 15-lbf metric 

should be used in parallel with the 689-kPa (100 psi) pressure limit as long as neither 

limits are exceeded. In some cases, designing to 15 lbf will exceed the pressure 

specification of 689 kPa (100 psi) and therefore should be reduced to ensure both limits 

are maintained.

Moreover, the processor package substrate should not be used as a mechanical 

reference or load-bearing surface for the thermal or mechanical solution. 

The Micro-FCBGA package incorporates land-side capacitors. The land-side capacitors 

are electrically conductive so care should be taken to avoid contacting the capacitors 

with other electrically conductive materials on the motherboard. Doing so may short 

the capacitors and possibly damage the device or render it inactive.