Intel 7140N LF80550KF093007 Data Sheet
Product codes
LF80550KF093007
Thermal Specifications
74
Dual-Core Intel® Xeon® Processor 7100 Series Datasheet
The upper point of the thermal profile consists of the Thermal Design Power (TDP)
defined in
defined in
CASE
value. The lower point of the thermal
profile consists of x = P
CONTROL_BASE
and y = T
CASE_MAX
@ P
CONTROL_BASE
. Pcontrol is
defined as the processor power at which T
CASE
, calculated from the thermal profile,
corresponds to the lowest possible value of Tcontrol. This point is associated with the
Tcontrol value (see
Tcontrol value (see
). However, because Tcontrol represents a diode
temperature, it is necessary to define the associated case temperature. This is
T
T
CASE_MAX
@ P
CONTROL_BASE
. Please see
and the Dual-Core Intel® Xeon®
Processor 7100 Series Thermal/Mechanical Design Guidelines for proper usage of the
Tcontrol specification.
Tcontrol specification.
The case temperature is defined at the geometric top center of the processor IHS.
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the TDP indicated in
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the TDP indicated in
. The Thermal
Monitor feature is intended to help protect the processor in the event that an
application exceeds the TDP recommendation for a sustained time period. For more
details on this feature, refer to
application exceeds the TDP recommendation for a sustained time period. For more
details on this feature, refer to
. To ensure maximum flexibility for future
requirements, systems should be designed to the Flexible Motherboard (FMB)
guidelines, even if a processor with a lower thermal dissipation is currently planned.
Thermal Monitor or Thermal Monitor 2 feature must be enabled for the
processor to remain within specification.
guidelines, even if a processor with a lower thermal dissipation is currently planned.
Thermal Monitor or Thermal Monitor 2 feature must be enabled for the
processor to remain within specification.
Note:
1.
1.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not
the maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
2.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting future thermal requirements.
See
for further information on FMB.
Table 6-1.
Dual-Core Intel® Xeon® Processor 7100 Series Thermal Specifications
QDF / S-Spec
Frequency
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Greater than 3.0 GHz
150
5
and
1,2
Less than or equal to
3.0 GHz
95
5
and
1,2