Intel Xeon L5215 AT80573JH0366M Data Sheet
Product codes
AT80573JH0366M
77
Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the loadline specifications in
2.
Thermal Design Power (TDP) should be used for the processor thermal solution design targets. TDP is not
the maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on silicon characterization.
4.
Power specifications are defined at all VIDs found in
. The Dual-Core Intel® Xeon® Processor
E5200 Series may be shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1.
for discrete points that constitute the thermal profile.
2.
Implementation of the Dual-Core Intel® Xeon® Processor E5200 Series Thermal Profile should result in
virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet the processor
Thermal Profile will result in increased probability of TCC activation and may incur measurable performance
loss.
3.
Refer to the Dual-Core Intel® Xeon® Processor 5200 Series Thermal/Mechanical Design Guidelines
(TMDG) for system and environmental implementation details
Table 6-1.
Dual-Core Intel® Xeon® Processor E5200 Series Thermal Specifications
Core
Frequency
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
65
5
See
;
1, 2, 3, 4, 5
Figure 6-1. Dual-Core Intel® Xeon® Processor E5200 Series Thermal Profile
40
45
50
55
60
65
70
0
10
20
30
40
50
60
Pow e r [W]
Tc
a
s
e
[C
]
Thermal Profile
Y = 0.354*x +43
Y = 0.354*x +43
40
45
50
55
60
65
70
0
10
20
30
40
50
60
Pow e r [W]
Tc
a
s
e
[C
]
Thermal Profile
Y = 0.354*x +43
Y = 0.354*x +43