Intel Xeon L5215 AT80573JH0366M Data Sheet

Product codes
AT80573JH0366M
Page of 114
83
Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
 for all processor frequencies. Systems must be designed to ensure 
the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds V
CC_MAX
 
at specified ICC. Please refer to the loadline specifications in 
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the 
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based pre-silicon estimates and simulations. These specifications will be updated 
with characterized data from silicon measurements in a future release of this document.
4.
Power specifications are defined at all VIDs found in 
. The Dual-Core Intel® Xeon® Processor 
L5215 may be shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor 
frequency requirements. 
Notes:
1.
Dual-Core Intel® Xeon® Processor L5215 Thermal Profile is representative of a volumetrically constrained 
platform. Please refer to 
 for discrete points that constitute the thermal profile.
Table 6-9.
Dual-Core Intel® Xeon® Processor L5238 Thermal Profile Table
Power (W)
Nominal T
CASE_MAX
 (°C)
Short-term T
CASE_MAX
 (°C)
0
45
60
5
49
64
10
52
67
15
56
71
20
60
75
25
64
79
30
67
82
35
71
86
Table 6-10. Dual-Core Intel® Xeon® Processor L5215 Thermal Specifications
Core
Frequency
Thermal 
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
20
5
Se
1, 2, 3, 4, 5
Figure 6-5. Dual-Core Intel® Xeon® Processor L5215 Thermal Profile
Thermal Profile
30
40
50
60
70
80
90
100
0
5
10
15
20
Power (W)
T
CASE
 (C
)
Nominal
Short Term
T
CASE
 = 1.5 * P +  45
T
CASE
 = 1.5 * P + 60
T
CASE-MAX
@ TDP
Short-term  Thermal Profile may only be used for 
short term  excursions to higher am bient 
temperatures, not to exceed 360 hours per year