Intel E5507 AT80602000795AA User Manual

138

Intel

®

 Xeon

®

 Processor 5500 Series Datasheet, Volume 1

The Boxed Active solution will be available for purchase for processors with TDP’s of 
80W and lower and will be an aluminum extrusion. This heat sink solution is intended 
to be used as an active heat sink only for pedestal chassis. 

representation of the heat sink solution.

Both active solutions will utilize a fan capable of 4-pin pulse width modulated (PWM) 
control. Use of a 4-pin PWM controlled active thermal solution helps customers meet 
acoustic targets in pedestal platforms through the baseboard’s ability to directly control 
the RPM of the processor heat sink fan. See 

 for more details on fan speed 

control, also see 

 for more on the PWM and PECI interface along with Digital 

Thermal Sensors (DTS).