Intel E5507 AT80602000795AA User Manual
Product codes
AT80602000795AA
Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1
43
Package Mechanical Specifications
3
Package Mechanical
Specifications
3.1
Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that
interfaces with the motherboard via an LGA1366 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink.
interfaces with the motherboard via an LGA1366 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink.
shows a sketch
of the processor package components and how they are assembled together. Refer to
the Processors and Socket in the Intel® Xeon® Processor 5500 Series Thermal /
Mechanical Design Guide (TMDG) for complete details on the LGA1366 socket.
the Processors and Socket in the Intel® Xeon® Processor 5500 Series Thermal /
Mechanical Design Guide (TMDG) for complete details on the LGA1366 socket.
The package components shown in
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Note:
1.
Socket and motherboard are included for reference and are not part of processor package.
Figure 3-1. Processor Package Assembly Sketch
IHS
Substrate
LGA1366 Socket
System Board
Capacitors
TIM
IHS
Substrate
LGA
System Board
Capacitors
Die
TIM