Intel 9150M NE80567KF028015 User Manual

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 contains dimensions for the thermocouple location on the Intel Itanium 

processor 9300 series package. This is the recommended location for the placement of 
a thermocouple for case temperature measurement.

Refer to the Package Mechanical Drawings in 

.

Environmental Storage Condition limits define the temperature and relative humidity 
limits to which the device is exposed to while being stored. The specified storage 
conditions are for component level prior to installation onto board.

Non operating storage condition limits for the component once installed onto the 
application board are not specified. Intel does not conduct component level certification 
assessments post subsequent applications such as components sub-assembly (FRU: 
Field Replaceable Unit), or installation onto a board given the multitude of attach 
methods, and board types used by customers. Provided as general guidance only, 
Intel®  board products are specified and certified to meet the following temperature 
and humidity limits (Non-Operating Temperature Limit: -40°C to 70°C and Humidity: 
50% to 90%, non condensing with a maximum wet bulb of 28°C).

Table specifies absolute maximum and minimum storage temperature limits which 
represent the maximum or minimum device condition beyond which damage, latent or 
otherwise, may occur. The table also specifies sustained storage temperature, relative 
humidity, and time-duration limits. These limits specify the maximum or minimum 
device storage conditions for a sustained period of time.  At conditions outside 
sustained limits, but within absolute maximum and minimum ratings, quality & 
reliability may be affected. 

Not to scale.

Substrate

CL

IHS

CL

Thermocouple
Attach Point

1.5 mm

Substrate

CL