Intel 2 Duo T7800 LE80537GG0644M User Manual

Datasheet

3

Introduction ..............................................................................................................7
1.1

Terminology .......................................................................................................8

Low Power Features ................................................................................................ 11
2.1

Clock Control and Low Power States .................................................................... 11
2.1.1

Core Low Power State Descriptions ........................................................... 13

Enhanced Intel SpeedStep® Technology .............................................................. 18
2.2.1

Electrical Specifications ........................................................................................... 23
3.1

Power and Ground Pins ...................................................................................... 23

FSB Clock (BCLK[1:0]) and Processor Clocking...................................................... 23

Voltage Identification ......................................................................................... 23

Reserved and Unused Pins.................................................................................. 26

FSB Signal Groups............................................................................................. 27

CMOS Signals ................................................................................................... 29

Maximum Ratings.............................................................................................. 29

3.10 Processor DC Specifications ................................................................................ 30

Package Mechanical Specifications and Pin Information .......................................... 41
4.1

Alphabetical Signals Reference ............................................................................ 69

Thermal Specifications and Design Considerations .................................................. 77
5.1

Thermal Specifications ....................................................................................... 80
5.1.1

Thermal Diode ....................................................................................... 81