Intel QX9775 EU80574XL088N Data Sheet

39

The processor may contain components on the substrate that define component 

keepout zone requirements. Decoupling capacitors are typically mounted to either the 

topside or landside of the package substrate. See 

 for keepout zones.

 provides dynamic and static load specifications for the processor package. 

These mechanical load limits should not be exceeded during heatsink assembly, 

mechanical stress testing or standard drop and shipping conditions. The heatsink 

attach solutions must not include continuous stress onto the processor with the 

exception of a uniform load to maintain the heatsink-to-processor thermal interface. 

Also, any mechanical system or component testing should not exceed these limits. The 

processor package substrate should not be used as a mechanical reference or load-

bearing surface for thermal or mechanical solutions.

NOTES:
1.

These specifications apply to uniform compressive loading in a direction perpendicular to 
the IHS top surface.

2.

This is the minimum and maximum static force that can be applied by the heatsink and 
retention solution to maintain the heatsink and processor interface.

3.

These specifications are based on limited testing for design characterization. Loading limits 
are for the LGA771 socket.

4.

Dynamic compressive load applies to all board thickness.

5.

Dynamic loading is defined as an 11 ms duration average load superimposed on the static 
load requirement.

6.

Test condition used a heatsink mass of 1 lbm with 50 g acceleration measured at heatsink 
mass. The dynamic portion of this specification in the product application can have 
flexibility in specific values, but the ultimate product of mass times acceleration should not 
exceed this dynamic load.

7.

Transient bend is defined as the transient board deflection during manufacturing such as 
board assembly and system integration. It is a relatively slow bending event compared to 
shock and vibration tests.

8.

Refer to the for information on heatsink clip load metrology.

Static 

Compressive Load

1.57 mm

0.062” 

80
18

311

70

N

lbf

1,2,3,8

2.16 mm

0.085”

111

25

311

70

N

lbf

2.54 mm

0.100”

133

30

311

70

N

lbf

Dynamic 

Compressive Load

NA

NA

311 N (max static 

compressive load) + 

222 N dynamic loading

70 lbf (max static 

compressive load) + 

50 lbf dynamic loading

N

lbf

1,3,4,5,6

Transient Bend 

Limits

1.57 mm

0.062” 

NA

750

me

1,3,7