Intel QX9775 EU80574XL088N Data Sheet
Product codes
EU80574XL088N
Thermal Specifications
76
Datasheet
details on this feature, refer to
. Thermal Monitor 1 and Thermal
Monitor 2 feature must be enabled for the processor to remain within its
specifications.
NOTES:
1.
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be
designed to ensure the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at specified I
CC
. Refer to the loadline
specifications in
.
2.
Thermal Design Power (TDP) should be used for the processor thermal solution design
targets. TDP is not the maximum power that the processor can dissipate. TDP is measured
at maximum T
targets. TDP is not the maximum power that the processor can dissipate. TDP is measured
at maximum T
CASE
.
3.
These specifications are based on silicon characterization.
4.
Power specifications are defined at all VIDs found in
. The processor may be
shipped under multiple VIDs for each frequency.
5.
The processor s intended for dual processor workstations only.
NOTES:
1.
1.
Refer to
for discrete points that constitute the thermal profile.
2.
Implementation of the processor Thermal Profile should result in virtually no TCC
activation. Furthermore, utilization of thermal solutions that do not meet the processor
Thermal Profile will result in increased probability of TCC activation and may incur
measurable performance loss. Refer to the appropriate processor Thermal and Mechanical
Design Guidelines (see
activation. Furthermore, utilization of thermal solutions that do not meet the processor
Thermal Profile will result in increased probability of TCC activation and may incur
measurable performance loss. Refer to the appropriate processor Thermal and Mechanical
Design Guidelines (see
) for system and environmental implementation details.
Table 5-1.
Processor Thermal Specifications
Core
Frequency
Maximum
Power
(W)
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
QX9775
155
150
5
See
1,2,3,4,5
Figure 5-1. Processor Thermal Profile
Thermal Profile (2U)
35
40
45
50
55
60
65
70
75
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
Power [W]
Tc
a
s
e
[
C
]
Thermal Profile
Y = 0.187*x + 35
Y = 0.187*x + 35
Thermal Profile (2U)
35
40
45
50
55
60
65
70
75
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
Power [W]
Tc
a
s
e
[
C
]
Thermal Profile
Y = 0.187*x + 35
Y = 0.187*x + 35