Intel AT80604004884AA User Manual
Thermal Specifications
114
Intel® Xeon® Processor 7500 Datasheet, Volume 1
applications. Intel has developed the thermal profile to allow customers to choose the
thermal solution and environmental parameters that best suit their platform
implementation.
thermal solution and environmental parameters that best suit their platform
implementation.
The 95W TDP processor (see
) is representative of a strongly
volumetrically constrained thermal solution (that is, industry enabled 1U heatsink). In
this scenario, it is expected that the Thermal Control Circuit (TCC) would only be
activated for very brief periods of time when running the most power intensive
applications. Intel has developed the thermal profile to allow customers to choose the
thermal solution and environmental parameters that best suit their platform
implementation.
this scenario, it is expected that the Thermal Control Circuit (TCC) would only be
activated for very brief periods of time when running the most power intensive
applications. Intel has developed the thermal profile to allow customers to choose the
thermal solution and environmental parameters that best suit their platform
implementation.
The upper point of the thermal profile consists of the Thermal Design Power (TDP) and
the associated T
the associated T
CASE_MAX
value. It should be noted that the upper point associated with
the Thermal Profile (x = TDP and y = T
CASE_MAX
P @ TDP) represents a thermal solution
design point. In actuality the processor case temperature may not reach this value due
to TCC activation. The lower point of the thermal profile consists of x = P
to TCC activation. The lower point of the thermal profile consists of x = P
_PROFILE_MIN
and y = T
CASE_MAX
@ P
_PROFILE_MIN
. P
_PROFILE_MIN
is defined as the processor power at
which T
CASE
, calculated from the thermal profile, is equal to Tcase_max.
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) instead of
the maximum processor power consumption. The Intel® Thermal Monitor feature is
intended to help protect the processor in the event that an application exceeds the TDP
recommendation for a sustained time period. For more details on this feature, refer to
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) instead of
the maximum processor power consumption. The Intel® Thermal Monitor feature is
intended to help protect the processor in the event that an application exceeds the TDP
recommendation for a sustained time period. For more details on this feature, refer to
. To ensure maximum flexibility for future requirements, systems should be
designed to the Flexible Motherboard (FMB) guidelines, even if a processor with lower
power dissipation is currently planned. The Intel® Thermal Monitor 1 or Intel®
Thermal Monitor 2 feature must be enabled for the processor to remain within its
specifications.
power dissipation is currently planned. The Intel® Thermal Monitor 1 or Intel®
Thermal Monitor 2 feature must be enabled for the processor to remain within its
specifications.
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on pre-silicon estimates and simulations. These specifications will be
updated with characterized data from silicon measurements in a future release of this document.
4.
Power specifications are defined at all VIDs found in
. The Intel® Xeon® processor 7500 series
may be shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Table 6-1.
Processor Thermal Specifications
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Processor Launch to FMB
130
5
See
;
1, 2, 3, 4, 5
Processor Launch to FMB
105
5
See
;
1, 2, 3, 4, 5
Processor Launch to FMB
95
5
See
;
1, 2, 3, 4, 5