Intel Xeon LV 5128 HH80556JH0364M Data Sheet

Product codes
HH80556JH0364M
Page of 112
Boxed Processor Specifications
108
Dual-Core Intel
® 
Xeon
® 
Processor 5100 Series Datasheet
The fan power header on the baseboard must be positioned to allow the fan heat sink 
power cable to reach it. The fan power header identification and location must be 
documented in the suppliers platform documentation, or on the baseboard itself. The 
baseboard fan power header should be positioned within 177.8 mm [7 in.] from the 
center of the processor socket.
8.3.2
Boxed Processor Cooling Requirements
As previously stated the boxed processor will be available in two product 
configurations. Each configuration will require unique design considerations. Meeting 
the processor’s temperature specifications is also the function of the thermal design of 
the entire system, and ultimately the responsibility of the system integrator. The 
processor temperature specifications are found in 
 of this document.
Table 8-1. 
PWM Fan Frequency Specifications for 4-Pin Active CEK Thermal Solution
Description
Min Frequency
Nominal Frequency
Max Frequency
Unit
PWM Control 
Frequency Range
21,000
25,000
28,000
Hz
Table 8-2. 
Fan Specifications for 4-Pin Active CEK Thermal Solution
Description
Min
Typ
Steady
Max 
Steady
Max
Startup
Unit
+12 V: 12 volt fan power supply
10.8
12
12
13.2
V
IC: Fan Current Draw
N/A
1
1.25
1.5
A
SENSE: SENSE frequency
2
2
2
2
Pulses per fan 
revolution
Figure 8-11. Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution
Table 8-3. 
Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution
Pin Number
Signal
Color
1
Ground
Black
2
Power: (+12 V)
Yellow
3
Sense: 2 pulses per revolution
Green
4
Control: 21 KHz-28 KHz
Blue