Intel W3680 AT80613003543AF Data Sheet

12

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

Commonly used terms are explained here for clarification:

• Dual-Core Intel® Xeon® Processor 3085, 3075, 3070, 3065, and 3060 — 

Dual core processor in the FC-LGA package with a 4 MB L2 cache.

• Dual-Core Intel® Xeon® Processor 3050 and 3040 — Dual core processor in 

the FC-LGA package with a 2 MB L2 cache.

• Processor — For this document, the term processor is the generic form of the 

Dual-Core Intel

®

 Xeon

®

 processor 3000 series. The processor is a single package 

that contains one or more execution units.

• Keep-out zone — The area on or near the processor that system design can not 

use. 

• Processor core — Processor core die with integrated L2 cache. 
• LGA775 socket — The processors mate with the system board through a surface 

mount, 775-land, LGA socket.

• Integrated heat spreader (IHS) —A component of the processor package used 

to enhance the thermal performance of the package. Component thermal solutions 
interface with the processor at the IHS surface.

• Retention mechanism (RM) — Since the LGA775 socket does not include any 

mechanical features for heatsink attach, a retention mechanism is required. 
Component thermal solutions should attach to the processor via a retention 
mechanism that is independent of the socket.

• FSB (Front Side Bus) — The electrical interface that connects the processor to 

the chipset. Also referred to as the processor system bus or the system bus. All 
memory and I/O transactions as well as interrupt messages pass between the 
processor and chipset over the FSB.

• Storage conditions — Refers to a non-operational state. The processor may be 

installed in a platform, in a tray, or loose. Processors may be sealed in packaging or 
exposed to free air. Under these conditions, processor lands should not be 
connected to any supply voltages, have any I/Os biased, or receive any clocks. 
Upon exposure to “free air”(i.e., unsealed packaging or a device removed from 
packaging material) the processor must be handled in accordance with moisture 
sensitivity labeling (MSL) as indicated on the packaging material.

• Functional operation — Refers to normal operating conditions in which all 

processor specifications, including DC, AC, system bus, signal quality, mechanical 
and thermal are satisfied. 

• Execute Disable Bit — The Execute Disable bit allows memory to be marked as 

executable or non-executable, when combined with a supporting operating system. 

If code attempts to run in non-executable memory the processor raises an error to 

the operating system. This feature can prevent some classes of viruses or worms 

that exploit buffer over run vulnerabilities and can thus help improve the overall 

security of the system. See the Intel

®

 Architecture Software Developer's Manual 

for more detailed information.