Intel E6540 HH80557PJ0534M User Manual

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This section describes the cooling requirements of the thermal module assembly 

solution used by the boxed processor.

The boxed processor may be directly cooled with a TMA. However, meeting the 

processor's temperature specification is also a function of the thermal design of the 

entire system, and ultimately the responsibility of the system integrator. The processor 

case temperature specification is listed in 

Chapter 6

. The boxed processor TMA is able 

to keep the processor temperature within the specifications (see 

) for chassis 

that provide good thermal management. For the boxed processor TMA to operate 

properly, it is critical that the airflow provided to the TMA is unimpeded. Airflow of the 

TMA is into the duct and out of the rear of the duct in a linear flow. Blocking the airflow 

to the TMA inlet reduces the cooling efficiency and decreases fan life. Filters will reduce 

or impede airflow which will result in a reduced performance of the TMA. The air 

temperature entering the fan should be kept below 35.5 °C. Meeting the processor's 

temperature specification is the responsibility of the system integrator. 

In addition, Type I TMA must be used with Type I chassis only and Type II TMA with 

Type II chassis only. Type I TMA will not fit in a Type II chassis due to the height 

difference. In the event a Type II TMA is installed in a Type I chassis, the gasket on the 

chassis will not seal against the Type II TMA and poor acoustic performance will occur 

as a result.

The boxed processor fan operates at different speeds over a short range of 

temperatures based on a thermistor located in the fan hub area. This allows the boxed 

processor fan to operate at a lower speed and noise level while thermistor 

temperatures are low. If the thermistor senses a temperatures increase beyond a lower 

set point, the fan speed will rise linearly with the temperature until the higher set point 

is reached. At that point, the fan speed is at its maximum. As fan speed increases, so 

do fan noise levels. These set points are represented in 

 

. 

The 

internal chassis temperature should be kept below 35.5 ºC. Meeting the processor’s 

temperature specification (see 

)

 is the responsibility of the system integrator. 

The motherboard must supply a constant +12 V to the processor’s power header to 

ensure proper operation of the variable speed fan for the boxed processor (refer to 

)

 for the specific requirements).