Intel AT80604004881AA User Manual
Intel® Xeon® Processor 7500 Datasheet, Volume 1
63
Processor Package Mechanical Specifications
3.1.2
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component
keep-out zone requirements. A thermal and mechanical solution design must not
intrude into the required keep-out zones. Decoupling capacitors are typically mounted
to either the topside or land-side of the package substrate. See
keep-out zone requirements. A thermal and mechanical solution design must not
intrude into the required keep-out zones. Decoupling capacitors are typically mounted
to either the topside or land-side of the package substrate. See
for keep-out zones. The location and quantity of package capacitors may
change due to manufacturing efficiencies but will remain within the component keep-in.
3.1.3
Package Loading Specifications
provides dynamic and static load specifications for the processor package.
These mechanical maximum load limits should not be exceeded during heatsink
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution. The minimum loading specification must be
maintained by any thermal and mechanical solutions.
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution. The minimum loading specification must be
maintained by any thermal and mechanical solutions.
.
Notes:
1.
These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2.
This is the maximum static force that can be applied by the heatsink and retention solution to maintain the
heatsink and processor interface.
3.
These specifications are based on limited testing for design characterization. Loading limits are for the
package only and do not include the limits of the processor socket.
4.
Dynamic loading is defined as an 11-ms duration average load superimposed on the static load
requirement.
3.1.4
Package Handling Guidelines
includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
handling loads may be experienced during heatsink removal.
3.1.5
Package Insertion Specifications
The processor can be inserted into and removed from a LGA1567 socket 15 times.
Table 3-1.
Processor Loading Specifications
Parameter
Maximum
Notes
Static Compressive Load
755 N
Allowable load on the package IHS
See notes 1, 2, 3
See notes 1, 2, 3
Dynamic Compressive Load
490 N
See notes 1, 3, 4
Transient Bend Load
778 N
See note 4
Table 3-2.
Package Handling Guidelines
Parameter
Maximum Notes
Shear
355 N
-
Tensile
155 N
-
Torque
7.9 N-m
-