Intel 2 Duo L7500 LE80537LG0254M User Manual
Product codes
LE80537LG0254M
Datasheet
37
Electrical Specifications
NOTES:
1.
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
V
IL
is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low
value.
3.
V
IH
is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high
value.
4.
V
IH
and V
OH
may experience excursions above V
CCP
. However, input signal drivers must comply with the
signal quality specifications.
5.
This is the pull-down driver resistance. Measured at 0.31*V
CCP
. R
ON
(min) = 0.38*R
TT
.
R
ON
(typ) =
0.45*R
TT
.
R
ON
(max) = 0.52*R
TT
.
6.
GTLREF should be generated from V
CCP
with a 1% tolerance resistor divider. The V
CCP
referred to in these
specifications is the instantaneous V
CCP
.
7.
R
TT
is the on-die termination resistance measured at V
OL
of the AGTL+ output driver. Measured at
0.31*V
CCP
. R
TT
is connected to V
CCP
on-die.
8.
Specified with on-die R
TT
and R
ON
are turned off. Vin (Input Voltage) between 0 and V
CCP
.
9.
Cpad includes die capacitance only. No package parasitics are included.
10.
This is the external resistor on the comp pins.
11.
On-die termination resistance, measured at 0.33*V
CCP
.
Table 9.
AGTL+ Signal Group DC Specifications
Symbol
Parameter
Min
Typ
Max
Unit
Notes
1
V
CCP
I/O Voltage
1.00
1.05
1.10
V
GTLREF
Reference Voltage
2/3 V
CCP
V
6
R
COMP
Compensation Resistor
27.23
27.5
27.78
Ω
10
R
ODT
Termination Resistor
55
Ω
11
V
IH
Input High Voltage
GTLREF +0.10
V
CCP
V
CCP
+0.10
V
3,6
V
IL
Input Low Voltage
-0.10
0
GTLREF-0.10
V
2,4
V
OH
Output High Voltage
V
CCP
-0.10
V
CCP
V
CCP
6
R
TT
Termination Resistance
50
55
61
Ω
7
R
ON
Buffer On Resistance
22
25
28
Ω
5
I
LI
Input Leakage Current
±100
µA
8
Cpad
Pad Capacitance
1.6
2.1
2.55
pF
9