Intel 530 LF80537NE0301M Data Sheet

Datasheet

33

The processor is available in a 1-MB, 478-pin Micro-FCPGA package. The package 

mechanical dimensions, keep-out zones, processor mass specifications, and package 

loading specifications are shown in 

 through 

.

The SFF processor (ULV DC) is available 956-ball Micro-FCBGA packages. The package 

mechanical dimensions are shown in Figure 7.

The maximum outgoing co-planarity is 0.2 mm (8 mils) for SFF Package

The mechanical package pressure specifications are in a direction normal to the surface 

of the processor. This requirement is to protect the processor die from fracture risk due 

to uneven die pressure distribution under tilt, stack-up tolerances and other similar 

conditions. These specifications assume that a mechanical attach is designed 

specifically to load one type of processor. 

Moreover, the processor package substrate should not be used as a mechanical 

reference or load-bearing surface for the thermal or mechanical solution. Please refer 

to the Santa Rosa Platform Mechanical Design Guide for more details.

For M-step based processors refer to the 2-MB package drawings.