Intel 530 LF80537NE0301M Data Sheet

Datasheet

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This document provides electrical, mechanical, and thermal specifications for the 

Intel® Celeron® Mobile Processor Dual-Core T1x00, Intel(R) Celeron Processors T3x00 

and Intel(R) Celeron Dual-core SFF Processors. The processor supports the Mobile 

Intel® 4 Series Express Chipset and Intel® 82801IBM (ICH9M) Controller-Hub Based 

Systems. 

In this document, the Celeron processor is referred to as the processor and Mobile 

Intel® 4 Series Express Chipset family is referred to as the (G)MCH. 

The following list provides some of the key features on this processor:

• Dual-Core processor for mobile with enhanced performance
• Intel architecture with Intel® Wide Dynamic Execution
• L1 Cache to Cache (C2C) transfer
• On-die, primary 32-KB instruction cache and 32-KB write-back data cache in each 

core

• On-die, 1-MB second level shared cache with advanced transfer cache architecture
• Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3) and 

Supplemental Streaming SIMD Extensions 3 (SSSE3)

• 667-MHz Source-Synchronous Front Side Bus (FSB) for the T1x00 Series, and 800-

MHz Source-Synchronous Front Side Bus (FSB) for the T3x00 Series processors 

and SFF processors

• Digital Thermal Sensor (DTS)
• Intel® 64 Technology
• PSI2 functionality
• Execute Disable Bit support for enhanced security
• Half ratio support (N/2) for Core to Bus ratio
• Supports enhanced Intel® Virtualization Technology (SFF processor only)
• Intel® Deeper Sleep low-power state with P_LVL4 I/O Support (SFF processor 

only)

• Advanced power management feature includes Enhanced Intel SpeedStep® 

Technology (SFF processor only)