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Intel 530 LF80537NE0301M Data Sheet

Product codes
LF80537NE0301M
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Thermal Specifications and Design Considerations
84
Datasheet
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic 
mode is used to indicate that the maximum T
J
 has been reached. Refer to 
 for details.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within 
specifications. 
5.
At Tj of 100 
o
C
6.
At Tj of 50 
o
C
7.
At Tj of 35 
o
C
8.
512-KB L2 cache
Table 25.
Power Specifications for the Ultra Low Voltage Dual-Core 1M Cache Intel 
Celeron (SFF) Genuine Intel Processor
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is not the 
maximum theoretical power the processor can generate. 
2.
Not 100% tested. These power specifications are determined by characterization of the processor currents 
at higher temperatures and extrapolating the values for the temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic 
mode is used to indicate that the maximum T
J
 has been reached. Refer to 
 
for more details.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within 
specifications.
5.
At Tj of 100 
o
C
6.
At Tj of 50 °C
7.
At Tj of 35 
o
C
5.1
Monitoring Die Temperature
The processor incorporates three methods of monitoring die temperature: 
• Thermal  Diode
• Intel Thermal Monitor 
• Digital Thermal Sensor
Symbol
Processor 
Number
Core Frequency
Thermal Design 
Power
Unit
Notes
TDP
SU2300
1.2 GHz
10
W
1, 4, 5
Symbol
Parameter
Min Typ
Max
Unit
Notes
P
AH,
P
SGNT
Auto Halt, Stop Grant Power
2.9
W
2, 6
P
SLP
Sleep Power 
2.9
W
2, 6
P
DSLP
Deep Sleep Power 
1.3
W
2,7
P
DPRSLP
Deeper Sleep Power
0.6
W
2, 7
T
J
Junction Temperature
0
100
°C
3,4