Intel Core Duo T2700 LF80539GF0532MX User Manual

Product codes
LF80539GF0532MX
Page of 91
Electrical Specifications
40
Datasheet
.
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
The V
CCP
 referred to in these specifications refers to instantaneous V
CCP
.
3.
Reserved.
4.
Measured at 0.1*V
CCP
5.
Measured at 0.9*V
CCP
6.
For Vin between 0 V and V
CCP
. Measured when the driver is tristated.
7.
Cpad1 includes die capacitance only for DPRSTP#, DPSLP#,PWRGOOD. No package parasitics are included.
8.
Cpad2 includes die capacitance for all other CMOS input signals. No package parasitics are included.
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
Measured at 0.2*V
CCP
.
3.
V
OH
 is determined by value of the external pullup resistor to V
CCP
. Please contact your Intel representative 
for details.
4.
For Vin between 0 V and V
OH
.
5.
Cpad includes die capacitance only. No package parasitics are included.
§
Table 13.
CMOS Signal Group DC Specifications
Symbol
Parameter
Min
Typ
Max
Unit
Notes
1
V
CCP
I/O Voltage
1.0
1.05
1.10
V
V
IL
Input Low Voltage CMOS
-0.1
0.0
0.33
V
2, 3
V
IH
Input High Voltage
0.7
1.05
1.20
V
2
V
OL
Output Low Voltage
-0.1
0
0.11
V
2
V
OH
Output High Voltage
0.9
V
CCP
1.20
V
2
I
OL
Output Low Current
1.3
4.1
mA
4
I
OH
Output High Current
1.3
4.1
mA
5
I
LI
Input Leakage Current
±100
µA
6
Cpad1
Pad Capacitance
1.8
2.3
2.75
pF
7
Cpad2
Pad Capacitance for CMOS Input
0.95
1.2
1.45
pF
8
Table 14.
Open Drain Signal Group DC Specifications
Symbol
Parameter
Min
Typ
Max
Unit
Notes
1
V
OH
Output High Voltage
1.0
1.05
1.10
V
3
V
OL
Output Low Voltage
0
0.20
V
I
OL
Output Low Current
11.40
50
mA
2
I
Leak
Output Leakage Current
±200
µA
4
Cpad
Pad Capacitance
1.8
2.3
2.75
pF
5